Title:
HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2015/115449
Kind Code:
A1
Abstract:
Provided is a hot melt adhesive that has high fluidity during when melted, exhibits high adhesive strength between PP nonwoven fabrics, and has high adhesiveness with PE film/PP nonwoven fabric and long-term stability. A hot melt adhesive having at least one type selected from (A) a propylene homopolymer that satisfies (i) to (iii) below, and (B) a styrene random copolymer and an elastomer having an elongation at break of 700% or more and a tensile modulus of elasticity of 10 MPa or less. (i) The tensile modulus of elasticity at 23°C is 400 MPa or less, (ii) the weight-average molecular weight (Mw) is 10,000 to 150,000, and (iii) Mw/Mn is 2.5 or less.
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Inventors:
KOBAYASHI KENJI (JP)
TATSUMI TOMIO (JP)
TATSUMI TOMIO (JP)
Application Number:
PCT/JP2015/052267
Publication Date:
August 06, 2015
Filing Date:
January 28, 2015
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C09J123/12; C09J109/06; C09J121/00; C09J125/10
Domestic Patent References:
| WO2003091289A1 | 2003-11-06 | |||
| WO2001096490A1 | 2001-12-20 | |||
| WO2009113153A1 | 2009-09-17 | |||
| WO2014077258A1 | 2014-05-22 |
Foreign References:
| JP2013064055A | 2013-04-11 | |||
| JP2013064056A | 2013-04-11 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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