Title:
HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2018/230210
Kind Code:
A1
Abstract:
One aspect of the present invention is a hot melt adhesive containing a thermoplastic polymer, a tackifier, and a softening agent, wherein: the thermoplastic polymer contains a copolymer comprising a first block which comprises a conjugated diene-based compound and a second block which comprises a vinyl aromatic hydrocarbon and/or a hydrogenated product of the copolymer; the copolymer is such that the content of the second block is less than 30 mass% and the content of a diblock structure of the first block and the second block is 10 mass% or more; the content of the copolymer and the hydrogenated product thereof is 55 mass% or more relative to the overall quantity of the thermoplastic polymer; and the content of the softening agent is 15-30 parts by mass relative to 100 parts by mass of the hot melt adhesive.
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Inventors:
SAMITSU MAKI (JP)
ARITA SHUHEI (JP)
ARITA SHUHEI (JP)
Application Number:
PCT/JP2018/018194
Publication Date:
December 20, 2018
Filing Date:
May 10, 2018
Export Citation:
Assignee:
MORESCO CORP (JP)
International Classes:
C09J153/02; C09J11/06
Domestic Patent References:
| WO2015125546A1 | 2015-08-27 | |||
| WO2018074070A1 | 2018-04-26 |
Foreign References:
| JP2015091917A | 2015-05-14 | |||
| JP2016153448A | 2016-08-25 | |||
| JP2015028118A | 2015-02-12 | |||
| JP2006143870A | 2006-06-08 | |||
| JP2001279212A | 2001-10-10 | |||
| JP2001271049A | 2001-10-02 | |||
| JP2018058940A | 2018-04-12 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
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