Title:
HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2019/131972
Kind Code:
A1
Abstract:
A hot melt adhesive suitable for positioning of an absorbent article is provided which is used as an adhesive for positioning of an absorbent article, and which, even when an absorbent article is stored within a broad temperature range (0-40°C) and is then used at said temperature (in particular, a low temperature or a high temperature), does not shift away from the position where the absorbent article has been attached to an article of clothing, does not leave adhesive residue on clothing when peeled away from the clothing even after prolonged use, and does not result in destruction of the substrate when peeled away. Specifically, this hot melt adhesive is characterized by containing components A-D below: a copolymer A that is a styrene-butadiene block copolymer and/or a styrene-isoprene block copolymer, a tackifying resin B solid at 25°C, a tackifying resin C liquid at 25°C, and an oil D with a viscosity index of 80 or greater, wherein, of a total 100 mass% of A to D, the content of the oil D is 10-25 mass%.
Inventors:
HIKASA YURI (JP)
MURAMOTO TADASHI (JP)
GENMA RIKIO (JP)
MURAMOTO TADASHI (JP)
GENMA RIKIO (JP)
Application Number:
PCT/JP2018/048372
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C09J153/02; C09J11/06
Domestic Patent References:
| WO2018151190A1 | 2018-08-23 |
Foreign References:
| JP2008239931A | 2008-10-09 | |||
| JP2013090879A | 2013-05-16 | |||
| JP2014227461A | 2014-12-08 | |||
| CN104694047A | 2015-06-10 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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