Title:
HOT-MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2020/122008
Kind Code:
A1
Abstract:
The problem of the invention is to provide a hot-melt adhesive having reduced thread formation at the time of applying, excellent thermal resistance and thermal stability after bonding. The means for solving the problem is a hot-melt adhesive comprising a copolymer of ethylene and olefins having 3 to 20 carbon atoms (A), a copolymer of ethylene and carboxylate esters having ethylenically double bonds (B), a tackifying resin (C) and a wax (D), wherein the copolymer of ethylene and olefins having 3 to 20 carbon atoms (A) comprises a metallocene-type propylene/ethylene copolymer (A1).
Inventors:
TAKAMORI AI (JP)
Application Number:
PCT/JP2019/048070
Publication Date:
June 18, 2020
Filing Date:
December 09, 2019
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
C09J123/08; C08L23/08; C08L23/14; C09J123/14
Domestic Patent References:
| WO2012115279A1 | 2012-08-30 | |||
| WO2006082478A2 | 2006-08-10 | |||
| WO2017081632A1 | 2017-05-18 |
Foreign References:
| US20180334597A1 | 2018-11-22 | |||
| JP2012177009A | 2012-09-13 | |||
| JP2008527067A | 2008-07-24 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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