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Title:
HOT-MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2020/122013
Kind Code:
A1
Abstract:
Objective of the invention is to provide a hot-melt adhesive excellent in thermal resistance, good in adhesiveness over a wide range from low temperature to high temperature, and also excellent in thermal stability. Means for solving the problem is a hot-melt adhesive comprising an olefin copolymer (A), a tackifying resin (B) and a wax (C), wherein the olefin copolymer (A) comprises a metallocene-type ethylene/α-olefin copolymer (A1) having a melting point of 100 to 140°C.

Inventors:
TAKAMORI AI (JP)
Application Number:
PCT/JP2019/048077
Publication Date:
June 18, 2020
Filing Date:
December 09, 2019
Export Citation:
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Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
C09J123/14; C08L23/08; C08L23/14
Foreign References:
US20160130480A12016-05-12
US20150166850A12015-06-18
US20180002579A12018-01-04
JP2017538806A2017-12-28
JP2012177009A2012-09-13
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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