Title:
HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2022/181690
Kind Code:
A1
Abstract:
The present invention provides a hot melt adhesive which is able to be applied at low temperatures, while having excellent heat resistance, excellent bondability, an appropriate length of open time and a short set time. The present invention specifically provides a hot melt adhesive which has a ring and ball softening point of 140°C or more and a melt viscosity of 3000 mPa·s or less at 163°C, wherein if T1 is the highest temperature at which tanδ ((loss elastic modulus G")/(storage elastic modulus G')) is 1 as determined by a temperature raising method by performing a dynamic viscoelasticity measurement (temperature raising method) in a rotating shear mode at a vibration frequency of 1 Hz, at a heating rate of 5°C/min for a temperature range from -40°C to 200°C, and T2 is the highest temperature at which tanδ ((loss elastic modulus G")/(storage elastic modulus G')) is 1 as determined by a temperature lowering method by performing a dynamic viscoelasticity measurement (temperature lowering method) in a rotating shear mode at a vibration frequency of 1 Hz, at a cooling rate of 5°C/min for a temperature range from 200°C to -40°C, the difference between T1 and T2 is 20°C or more.
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Inventors:
MIYAKE TAKESHI (JP)
Application Number:
PCT/JP2022/007604
Publication Date:
September 01, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C09J11/08; C08L23/12; C08L53/00; C08L101/12; C09J123/00; C09J123/12; C09J125/08; C09J153/00; C09J201/00
Domestic Patent References:
| WO2019004376A1 | 2019-01-03 |
Foreign References:
| JP2014172995A | 2014-09-22 | |||
| JPH07310063A | 1995-11-28 | |||
| JP2020063448A | 2020-04-23 | |||
| JP2020070344A | 2020-05-07 | |||
| JPS6281470A | 1987-04-14 | |||
| JP2001040315A | 2001-02-13 | |||
| JPH11199833A | 1999-07-27 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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