Title:
HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/022193
Kind Code:
A1
Abstract:
To provide a hot melt adhesive having excellent low temperature coatability and creep resistance, a good balance between tack and cohesive force, and being able to bond and keep an elastic material to a non-woven fabric or a plastic film. A hot melt adhesive comprising (A) a thermoplastic block copolymer which is a copolymer of vinyl aromatic hydrocarbons and conjugated diene compounds, (B) a tackifying resin, and (C) a plasticizer, wherein (A) the thermoplastic block copolymer comprises the following component (A1) and component (A2): (A1) a styrene isoprene block copolymer having a styrene content of more than 40% by mass; and (A2) a styrene isoprene block copolymer having a styrene content of more than 15% by mass and less than 30% by mass.
Inventors:
KAKUDA ATSUSHI (JP)
HAYAKAWA TADASHI (JP)
HAYAKAWA TADASHI (JP)
Application Number:
PCT/JP2022/031202
Publication Date:
February 23, 2023
Filing Date:
August 18, 2022
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
C09J153/02; C08L53/02
Domestic Patent References:
| WO2020110921A1 | 2020-06-04 |
Foreign References:
| EP3259327A1 | 2017-12-27 | |||
| EP3081611A1 | 2016-10-19 | |||
| JP2016153448A | 2016-08-25 | |||
| JP2016044289A | 2016-04-04 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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