Title:
HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/106366
Kind Code:
A1
Abstract:
Disclosed is a hot melt adhesive, comprising: (A) a copolymer of ethylene with an olefin having 3 to 20 carbon atoms; (B) an ethylene-carboxylic acid ester copolymer; and (C) a wax, wherein the (A) copolymer of ethylene with an olefin having 3 to 20 carbon atoms comprises (A1) a metallocene-based copolymer of ethylene with propylene, and the (B) ethylene-carboxylic acid ester copolymer comprises (B1) an ethylene-carboxylic acid ester copolymer which has a structural unit derived from the carboxylic acid ester in an amount of 2% by mass or more and less than 25% by mass, and a melt flow rate of 1 to 400 g/10 min.
Inventors:
TAKAMORI AI (JP)
Application Number:
PCT/JP2022/045272
Publication Date:
June 15, 2023
Filing Date:
December 08, 2022
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
C09J123/08; C08L23/08; C08L23/14; C09J123/14
Domestic Patent References:
| WO2020122008A1 | 2020-06-18 | |||
| WO2022124256A1 | 2022-06-16 | |||
| WO2022124257A1 | 2022-06-16 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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