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Patent Searching and Data


Title:
HOT MELT ADHESIVES FOR DERMAL APPLICATION
Document Type and Number:
WIPO Patent Application WO2002053197
Kind Code:
A3
Abstract:
A pressure sensitive hot melt adhesive composition which comprises a high molecular weight rubber and less than about 60 parts by weight of a liquid diluent, and has a G' of less than about 15 x 104 dynes/cm2 at 10 rad/s at 25 DEG C is useful for adhesive skin application (e.g., surgical tape), including transdermal drug delivery applications.

Inventors:
CHARLES W PAUL
Application Number:
PCT/US2001/049309
Publication Date:
September 12, 2002
Filing Date:
December 20, 2001
Export Citation:
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Assignee:
NAT STARCH CHEM INVEST (US)
International Classes:
A61K9/70; A61K47/32; A61L15/44; A61L15/58; C09J153/00; (IPC1-7): A61L15/58; C09J153/00
Domestic Patent References:
WO1997019582A21997-06-05
WO1999066000A11999-12-23
Foreign References:
US5559165A1996-09-24
US6120899A2000-09-19
CA2164376A11997-06-05
US6143317A2000-11-07
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