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Patent Searching and Data


Title:
HOT MELT ADHESIVES AND DISPOSABLE PRODUCTS USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2016/170796
Kind Code:
A1
Abstract:
The present invention provides hot melt adhesives. A hot melt adhesive according to the present invention contains a styrenic block copolymer (A) containing a styrene-butadiene-styrene block copolymer (A1); and at least one styrenic block copolymer (A4) selected from the group consisting of a styrene-butadiene-styrene block copolymer (A2) and a styrene-isoprene-styrene block copolymer (A3), wherein the styrenic block copolymer (A) contains a predetermined amount of the styrene-butadiene-styrene block copolymer (A1) relative to the total amount of the styrene-butadiene-styrene block copolymer (A1) and the styrenic block copolymer (A4); a tackifier (B); and a plasticizer (C), wherein the hot melt adhesive has a melt viscosity of 6000 mPa s or lower.

Inventors:
SUGIMOTO TETSUYASU (JP)
SOMEYA YU (JP)
GENMA RIKIO (JP)
YOSHII MUNETAKA (JP)
KOIKE MAMORU (JP)
SUZUKI KAZUYA (JP)
Application Number:
PCT/JP2016/002157
Publication Date:
October 27, 2016
Filing Date:
April 22, 2016
Export Citation:
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Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C09J153/02; C09J11/06
Domestic Patent References:
WO2014175410A12014-10-30
WO2012112870A22012-08-23
Foreign References:
JP2008239931A2008-10-09
US6232391B12001-05-15
JPH0762316A1995-03-07
JP2016044289A2016-04-04
JP2016065121A2016-04-28
Other References:
See also references of EP 3286275A4
Attorney, Agent or Firm:
YAMAMOTO, Takuya (21-22 Showa-cho 1-chome, Abeno-ku, Osaka-sh, Osaka 11, JP)
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