Title:
HOT-MELT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/138099
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a hot-melt composition which is excellent in terms of applicability, unsusceptibility to thermal flowing, balance between bonding and debonding properties, nonvolatile property, and high-temperature creep resistance. This hot-melt composition comprises: thermoplastic elastomers (1) comprising a styrene-based thermoplastic elastomer (1a) having a weight-average molecular weight of 300,000 or higher, a styrene-based thermoplastic elastomer (1b) having a styrene content of 20 mass% or less, and an olefin-based thermoplastic elastomer (1c) including an ethylene/propylene rubber and/or a butyl rubber; a tackifier (2) comprising an aromatic petroleum resin (2a), a terpene-phenol resin (2b), and an amorphous polyalphaolefin (2c); a high-molecular-weight paraffin oil (3a) having a weight-average molecular weight of 1,000 or higher; and a low-molecular-weight paraffin oil (3b) having a weight-average molecular weight less than 1,000.
More Like This:
JPH05136260 | WAFER PROCESSING TAPE |
JPS62267382 | ADHESIVE FOR TILE |
JP6125730 | How to transfer a semiconductor device alternatively |
Inventors:
MATSUMURA MISAKI (JP)
Application Number:
PCT/JP2021/044651
Publication Date:
June 30, 2022
Filing Date:
December 06, 2021
Export Citation:
Assignee:
SIKA HAMATITE CO LTD (JP)
International Classes:
C09J11/06; C08K5/01; C08L23/02; C08L53/02; C08L65/00; C08L91/00; C09J11/08; C09J123/02; C09J153/02; C09J165/00; C09J191/00
Foreign References:
JP2011195797A | 2011-10-06 | |||
JPH09208928A | 1997-08-12 | |||
JP2001011409A | 2001-01-16 | |||
JPH01217093A | 1989-08-30 | |||
JPH03188175A | 1991-08-16 | |||
JP2020076101A | 2020-05-21 | |||
JP2012077251A | 2012-04-19 | |||
JP2019073581A | 2019-05-16 | |||
EP1584654A1 | 2005-10-12 | |||
CN112094608A | 2020-12-18 | |||
JP2018104594A | 2018-07-05 | |||
JPH0334044B2 | 1991-05-21 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF: