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Patent Searching and Data


Title:
HOT MELT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/195539
Kind Code:
A1
Abstract:
The present invention provides a hot melt composition from which an expandable member having excellent extensibility, expansion/contraction recovery, and stress maintenance during extension at a high temperature can be formed, and which has excellent coating suitability. The present invention provides a hot melt composition containing a thermoplastic resin (A) and a plasticizer (B), the hot melt composition being characterized in that: the thermoplastic resin (A) contains a hydrogenated styrene-based block copolymer (A1) having a styrene content of 40-65 mass%; and the stress maintenance rate of the hot melt composition after being held for 1 hour in a double-stretched state under a temperature condition of 40ºC is at least 50%.

Inventors:
SOMEYA YU (JP)
HIKASA YURI (JP)
Application Number:
PCT/JP2023/014429
Publication Date:
October 12, 2023
Filing Date:
April 07, 2023
Export Citation:
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Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C08L53/02; C09J11/00; C09J11/08; C09J125/08; C09J153/00
Domestic Patent References:
WO2018151190A12018-08-23
WO2020110921A12020-06-04
WO2019151369A12019-08-08
WO2019026891A12019-02-07
Foreign References:
JP2016060847A2016-04-25
JP2021001263A2021-01-07
JPH1088097A1998-04-07
JP2016044289A2016-04-04
JP2018021112A2018-02-08
JP2011162747A2011-08-25
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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