Title:
HOT MELT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/195539
Kind Code:
A1
Abstract:
The present invention provides a hot melt composition from which an expandable member having excellent extensibility, expansion/contraction recovery, and stress maintenance during extension at a high temperature can be formed, and which has excellent coating suitability. The present invention provides a hot melt composition containing a thermoplastic resin (A) and a plasticizer (B), the hot melt composition being characterized in that: the thermoplastic resin (A) contains a hydrogenated styrene-based block copolymer (A1) having a styrene content of 40-65 mass%; and the stress maintenance rate of the hot melt composition after being held for 1 hour in a double-stretched state under a temperature condition of 40ºC is at least 50%.
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Inventors:
SOMEYA YU (JP)
HIKASA YURI (JP)
HIKASA YURI (JP)
Application Number:
PCT/JP2023/014429
Publication Date:
October 12, 2023
Filing Date:
April 07, 2023
Export Citation:
Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C08L53/02; C09J11/00; C09J11/08; C09J125/08; C09J153/00
Domestic Patent References:
WO2018151190A1 | 2018-08-23 | |||
WO2020110921A1 | 2020-06-04 | |||
WO2019151369A1 | 2019-08-08 | |||
WO2019026891A1 | 2019-02-07 |
Foreign References:
JP2016060847A | 2016-04-25 | |||
JP2021001263A | 2021-01-07 | |||
JPH1088097A | 1998-04-07 | |||
JP2016044289A | 2016-04-04 | |||
JP2018021112A | 2018-02-08 | |||
JP2011162747A | 2011-08-25 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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