Title:
HOT-MELT RESIN COMPOSITION FOR CORRUGATED CARDBOARD
Document Type and Number:
WIPO Patent Application WO/2014/038671
Kind Code:
A1
Abstract:
The present invention relates to a hot-melt resin composition for corrugated cardboard, the composition comprising 25-50 mass% ethylene/vinyl acetate copolymer resin (EVA), 10-60 mass% tackifier, 10-30 mass% wax ingredient, and 0.3-5 mass% α-olefin copolymer resin.
Inventors:
TANIGUCHI TOMOAKI (JP)
KATAGATA NOBUYOSHI (JP)
KATAGATA NOBUYOSHI (JP)
Application Number:
PCT/JP2013/074131
Publication Date:
March 13, 2014
Filing Date:
September 06, 2013
Export Citation:
Assignee:
HITACHI KASEI POLYMER CO LTD (JP)
International Classes:
C09J123/08; C09J11/00; C09J131/04
Foreign References:
| JP2007051235A | 2007-03-01 | |||
| JP2011148876A | 2011-08-04 | |||
| JPH08325539A | 1996-12-10 | |||
| JP2003238920A | 2003-08-27 | |||
| JP2008527067A | 2008-07-24 | |||
| JPH1072574A | 1998-03-17 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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