Title:
HOT PLATE FOR LAMINATING DEVICE AND LAMINATING DEVICE USING THE HOT PLATE
Document Type and Number:
WIPO Patent Application WO/2011/136132
Kind Code:
A1
Abstract:
Provided are a hot plate capable of equalizing a crosslink density in a processed article subjected to a laminating process, and a laminating device using the hot plate. Disclosed is a hot plate used in a laminating device comprising an upper chamber and a lower chamber divided by a pressing member, wherein the hot plate on which a processed article is placed is provided in the lower chamber, and the processed article heated by the hot plate is pressed between the hot plate and the pressing member and laminated by evacuating the lower chamber and introducing air to the upper chamber, and wherein the hot plate has heating areas substantially concentrically divided from the center to the periphery of the processed article, at least one of the heating areas is provided with a heater, and temperature control of the heating areas can be individually performed.
Inventors:
NAKAHAMA HIDENARI (JP)
MAEDA SHUJI (JP)
YANO KEISUKE (JP)
SHINODA TAKASHI (JP)
NAKANO HIROSHI (JP)
MAEDA SHUJI (JP)
YANO KEISUKE (JP)
SHINODA TAKASHI (JP)
NAKANO HIROSHI (JP)
Application Number:
PCT/JP2011/059892
Publication Date:
November 03, 2011
Filing Date:
April 15, 2011
Export Citation:
Assignee:
NISSHINBO MECHATRONICS INC (JP)
NAKAHAMA HIDENARI (JP)
MAEDA SHUJI (JP)
YANO KEISUKE (JP)
SHINODA TAKASHI (JP)
NAKANO HIROSHI (JP)
NAKAHAMA HIDENARI (JP)
MAEDA SHUJI (JP)
YANO KEISUKE (JP)
SHINODA TAKASHI (JP)
NAKANO HIROSHI (JP)
International Classes:
B29C65/24; H01L31/042; H05B3/00; H05B3/68
Foreign References:
| JP2009078547A | 2009-04-16 | |||
| JP2008047765A | 2008-02-28 | |||
| JP2005303014A | 2005-10-27 | |||
| JP2001338747A | 2001-12-07 | |||
| JP2002373764A | 2002-12-26 |
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Claims: