BACKGROUND

This invention relates generally to cooling of a cooling load through a thermoelectric cooling module, and, more particularly, to enhance cooling capacity of the module by lowering a temperature of a hot side of module.

Applications requiring chilling temperatures range to wide areas of usage, such as chilling vegetables, beverages, chilling for an air conditioning unit, etc. In general, the cooling and chilling of some of these applications are currently performed through cooler systems based on hermetically sealed compressors. Because such coolers are designed to bring down temperatures of a cooling load from a high temperature, exemplarily ranging from 41°C - 46°C, such as prevalent in certain tropical regions, to a chilled temperature region, such as 4°C - 6°C, energy consumption in such cooling applications remain high. Further, such cooling processes result in high operational and running costs, and the related high energy consumption rates are particularly accompanied by the requirement of a high capacity cooling engine as well. Furthermore, such compressors, having fixed electrical and mechanical losses, are not widely preferred modes of usage for such cooling applications. In addition, such conventionally applied compressors do not provide commensurate cost benefits, even with a reduction in cooler size or capacity. A drop in temperature is obtained at slow pace as well.

In particular, with such cooling applications requiring high capacity cooling engines, thermoelectric cooling modules form one of the alternate cooling solutions. Moreover, relatively improved cooling capacities in such thermoelectric applications, however, are also observed only when an ambient temperature allows a hot side of a thermoelectric module to remain below a certain temperature threshold. More particularly, enhanced cooling capacities are observed only when a temperature difference between the hot side and a cold side of the thermoelectric cooler is kept at a minimum.

There is therefore room for improvement in thermoelectric cooling systems to enable the lowering of a temperature at a hot side, allowing cooling of a cooling load through an enhanced cooling capacity, enabling relatively a more efficient cooling process. SUMMARY

On embodiment of the present disclosure discloses a thermoelectric cooling system including a hot side, the hot side at a first temperature. Additionally, the thermoelectric cooling system includes an ambient temperature configured around the hot side. A cold side configured to accept a cooling load is also included in the cooling system. Further, a mechanism adjacent the hot side for maintaining the first temperature of the hot side below the ambient temperature is configured in such a way that the first temperature of the hot side remains below the ambient temperature.

Another embodiment of the present application discloses a method of cooling through a thermoelectric module. The module includes a hot side having a first temperature, and an ambient temperature, which is configured around the hot side. A cold side is in the cooling module, which is configured to accept a cooling load. The method comprises maintaining the first temperature of the hot side below the ambient temperature through a mechanism adjacent the hot side for maintaining the first temperature of the hot side below the ambient temperature. Herein, the mechanism, adjacent the hot side for maintaining the first temperature of the hot side below the ambient temperature, includes an arrangement of air, a fluid, and a pad. More specifically, the pad is adapted to be wetted through the fluid, the fluid is configured to be stored in a sump and distributed over the pad, and air is configured to flow across the pad, cooling both the fluid and air. BRIEF DESCRIPTION OF THE DRAWINGS

The figures described below set out and illustrate a number of exemplary embodiments of the disclosure. Throughout the drawings, like reference numerals refer to identical or functionally similar elements. The drawings are illustrative in nature and are not drawn to scale. FIG. 1A is a schematic depicting an exemplary concept of a conventional thermoelectric cooling process.

FIG. IB is a schematic depicting an exemplary concept of a thermoelectric cooling process according to the present disclosure.

FIG. 2 is a graph according to an exemplary thermoelectric cooling process. FIG. 3A illustrates a thermoelectric cooler functioning through an active evaporation cooling process.

FIG. 3B illustrates a thermoelectric cooler functioning through a passive evaporation cooling process. FIG. 4 A illustrates a concept of the active evaporation cooling process. FIG. 4B illustrates a concept of the passive evaporation cooling process. FIG. 5 depicts a Psychrometric graph according to the present disclosure. DETAILED DESCRIPTION

The following detailed description is made with reference to the figures. Exemplary embodiments are described to illustrate the subject matter of the disclosure, not to limit its scope, which is defined by the appended claims.

Overview

In general, the present disclosure describes methods and systems for cooling a load through a thermoelectric cooling module by lowering a hot side temperature of the cooling module. To this end, an evaporative cooling process is employed to reduce temperatures of the hot side, allowing the temperature of the hot side to remain below a surrounding ambient temperature at all times. More particularly, passive and active evaporation cooling systems are structurally integrated into a thermoelectric cooling module to obtain a temperature of the hot side, lower than an ambient temperature, increasing a cooling capacity of a thermoelectric cooling module.

Exemplary embodiments

A hot side of a thermoelectric cooler, in conventional applications, includes a temperature that is, in general, higher relative to the temperatures prevailing in an ambient region surrounding the hot side region. This is because the hot side of the thermoelectric cooler is attached to the heat sink, forming the portion where heat is released when a DC power is applied. FIG. 1A accordingly depicts a cooling process, working through a conventionally known and applied thermoelectric cooling concept 100a. Herein, as well known in the art, the cooling concept 100a comprises a cold side 102, which is configured to accept a cooling load, a hot side 104, which includes a first temperature and is configured to function as a heat rejection sink, and an arrangement 106, that includes conventionally applied semiconductors, copper plates and ceramic substrates. The arrangement 106, being well known to the skilled in the art, will not be described further.

During a working of the concept 100a, a temperature difference (dT) between the cold side 102 and the hot side 104 forms a factor for determining a relative efficiency of the cooling process. Proportionally, a higher dT implies a higher work (cooling capacity) required, while a lower dT implies lesser work (cooling capacity) required. In such conventional cooling concepts, the dT depends primarily on an amount of heat rejected by the cooling process, and a temperature of an ambient region 150 prevalent around the hot side 104.

Another concept 100b, of an exemplary thermoelectric cooling process, depicted in FIG. IB of the present disclosure, depicts a methodology to restrict the temperature of the hot side 104 below an ambient temperature at all times, aiming to increase relative efficiency and cooling capacity in a thermoelectric cooling process. In particular, a solution discussed in the present disclosure operates towards bringing the temperature of the hot side 104 nearer to a wet bulb temperature, relative to prevailing temperature conditions and a corresponding relative humidity (RH) of the ambient region 150. Subsequently, when the dT obtained between the cold side 102 and hot side 104 is relatively lesser than the dT observed in conventional applications, the cooling capacity is increased, and a corresponding efficiency obtained is commensurately higher as well.

FIG. 2 depicts a graph 200 illustrating a relationship between the dT observed in conventional applications of thermoelectric cooling, and corresponding cooling capacity of the thermoelectric cooling engine. Accordingly, on the X-axis temperature difference (dT) is provided in °C, as shown, while on the Y-axis cooling capacity of the thermoelectric cooling engine is provided in watts. As illustrated, a line 202 depicts a current requirement of 14 ampere to carry out a relative amount of work in thermoelectric cooler. It can be seen that the relative cooling capacity of the thermoelectric engine increases from 50 watts to 90 watts when the dT is reduced from 50°C to 30°C. It will be understood that all similar temperature changes (dT) will result in an increase in cooling capacity of the thermoelectric engine up to a commensurate value, increasing an overall relative efficiency of the applied thermoelectric cooler. Similar results can be observed for all current curves (not shown) such as the line 202. Furthermore, it is understood that all values discussed above in relation to the graph 200 are exemplary in nature and may not be precise in relation to actual values.

The above discussed concepts are discussed further through sets of exemplary figures. Accordingly, FIG. 3A depicts an exemplary cooling application enabled through a thermoelectric module, referred to as a thermoelectric cooler system 300a. The system 300a includes the conventionally known cold side 102, the hot side 104, a cooling enclosure 302 configured to house a cooling load 304 that ranges from vegetables, beverages, consumables, up to an air conditioned room, as well as other cooling applications.

According to aspects of the present disclosure, a mechanism adjacent the hot side for maintaining the first temperature of the hot side below the ambient temperature, namely an active evaporative based cooling application 350a, is structurally in constant engagement with the thermoelectric cooler system 300a. In particular, the engagement of application 350a is directly to the hot side 104 of the system 300a, as shown in the figure. More particularly, the active evaporative based cooling application 350a includes an evaporative pad 316 configured to hold or capture an amount of fluid, referred to as water 306. The water 306, circulating as shown through the arrow B, is stored in a sump 308. A water pump 310 enables the circulation and distribution of water 306, as shown, through an arrow circuit 312, through which the water 306 circulates to reach above the evaporative pad 316, as shown. The water 306 is then distributed over the pad 316, and consequently wets the pad 316. Further, in this application, a fan 314, as illustrated in the figure, is configured to blow an amount of air, shown through the arrow A, into a first structure 317, the first structure 317 configured to primarily house the pad 316, water 306, and the pump 310.

In particular, the first structure 317 includes a slot 321, as shown, that allows for an insertion of the evaporative pad 316, to be in engagement with the first structure 317. Further, the slot 321 can have clips or snapping features (not shown) that can enable a reliable positioning of the pad 316 within the first structure 317. In more detail, the evaporative pad 316, as stated above, can have an exemplary cuboidal structure, as shown, enabling the pad 316 to fit within the slot 321 configured in the first structure 317. The openings or pores employed in the pad 316 can be larger than the ones employed for a pad during a passive evaporative cooling (discussed later), allowing more quantities of air to flow past the pad 316, during an operation. Hydrophobic coatings can be applied over the pad 316 to make the pad 316 water repellent, and also to inhibit bacterial and fungal growth. In application, the evaporative pad 316 can be configured to be applied in and removed from the slot 321 within the first structure 317 through a removable cartridge 319, enabling an easy insertion and removal of the pad 316 when the pad wears out, or loses its effectiveness and needs to be replaced with a new pad. Further, the snapping features or clips of the slot 321, as noted earlier, can enable a positive placement of the cartridge 319, housing the pad 316, within the first structure 317. In certain conventions, depending upon an ambient and prevailing energy conditions, the evaporative pad 316 can be replaced with an absorbent pad 316' (shown in FIG. 3B). Further, the structure, material, designs and manufacturing techniques for the evaporative pad 316, being well known to those skilled in the art, will not be discussed further.

The fan 314 is configured to blow a quantity of air into the first structure 317, where the blown air, shown through the arrow A, enters the first structure 317 through the evaporative pad 316. More so, the fan 314 is operated electrically and functions through a set of wiring 309 that runs from an electric supply all through the whole system 300a. A control panel 307 provides a mode for electrical connections and an interface for corresponding electrical operations. Furthermore, the pump 310 is operated electrically as well.

As stated, the pump 310 can be a widely employed pump configured to pump, circulate, and distribute water 306 over the evaporative pad 316. With the usage and application of the pump 310 being commonly known, the disclosure will include no further discussion of the pump 310.

During an operation, the fan 314, operating electrically, rotates and functions to direct an ambient air from the ambient region 150 into the first structure 317. The pump 310, also operating electrically, starts functioning and circulates the water 306, as shown, through the circuit 312, in the direction of the arrow B. The circuit 312 includes a system of piping that enables circulation of water 306 and a water distributor, with both the piping and the water distributor being described later. At the entrance of the first structure 317, the incoming air interacts with the evaporative pad 316. As the pad 316 is configured to be wetted through the circulation of water 306, the incoming air, depicted through the arrow A, drops the dry bulb temperature of the ambient region 150, and approaches a relative wet bulb temperature, depending upon the prevailing relative humidity (RH). Herein, both the water 306 and the incoming air cools down, with both encountering a drop in temperature. More so, as the air passes across the evaporative pad 316, the drop in temperature is accompanied by an increase in the mass of the air, because of increased moisture content as the air passes through the pad 316. Accordingly, the nearly saturated air is represented through the arrow A'. Subsequently, the fan 314, under a constant operation, pushes the air further through a passage 318, as shown in the figure, into the hot side 104, consequently cooling the hot side 104, and bringing the first temperature of the hot side 104 to below the temperature of the ambient region 150. Any air moving device or pump (not shown), configured to pump a desired quantity of air to the hot side 104, may alternatively be employed as well. At an exit 320, the air exits the first structure 317 and the overall system 300a, as shown through the arrow C. It will be understood that to keep energy consumption at a minimum, certain embodiments can include the thermoelectric cooling process to start only when the first temperature of the hot side 104 has fallen below the ambient temperature. Through the above discussed operation, it is understood that a drop in the temperature of an incoming air is accompanied by a drop in the temperature of the water 306, flowing through the pad 316, as well. Accordingly, the water 306, when drops back into the sump 308, shown through the arrow B, is cooler and at a lower temperature than the ambient temperature. Therefore, apart from the cooled air, represented through the arrow A', the water 306, being cooled as well, can be supplied to the hot side 104 through alternate circuits (not shown), to bring the temperature of the hot side 104 below an ambient temperature. In such configurations however, a water pump (not shown) can be required to pump the cooled water 306, from the sump 308, into the hot side 104 of the thermoelectric cooler system 300a, cooling the hot side 104 below the ambient temperature.

Certain thermoelectric cooling applications functioning through the above concept can include temperature sensors in certain embodiments that can sense the temperature of the hot side 104 and of the ambient region 150, and may accordingly activate the thermoelectric cooling process only when the temperature of the hot side 104 is observed to have fallen below the temperature of the ambient region 150. Further, upon a sensing of the temperature of the hot side 104, yielding temperature values equal or higher than the dry bulb temperature of the ambient region 150, enabling a consequent de-activation of the thermoelectric cooling process. Further, resumption in the thermoelectric cooling operation can be configured for only when the temperature of the hot side 104 falls below the temperature of the ambient regionl50 through the working of the application 350a. De-activations, such as mentioned above, can be enabled through a safety interlock mechanism that functions either when the water 306 runs below a predetermined threshold quantity, or when the fan 314, configured to blow air, becomes inoperative.

A controller (not shown) can process corresponding temperature signals, generating from the sensors, to activate/deactivate the thermoelectric cooling process, when required. Such arrangements, if provided, can ensure a reduction in any misuse of energy, lowering running and operational costs during a cooling process.

Alternatively, the concept of lowering the temperature of the hot side 104 is carried out through a passive evaporative cooling process. Accordingly, a thermoelectric cooler system 300b can be in a structural engagement to a passive evaporative based cooling application 350b, as shown in FIG. 3B, in place of the application 350a. Similar to the configurations for the thermoelectric cooler system 300a, the application 350b is in direct engagement to the hot side 104 of the system 300b. In contrast to the evaporative pad 316 employed in the system 300a, the passive evaporative based cooling incorporates an open micro porous absorbent pad 316' that is configured to absorb the water 306 as it is distributed through a water distributor 340, as shown, the absorption of water 306 being enabled through capillary action. Further, the pad 316' is configured to be flexible, like cloth, and can further be configured to include micro pores that absorb water, or any other liquid that the pad 316' has been placed in contact with. Further, the pores are sized such that when a quantity of air blows across or over the pad 316', the temperature of the hot side 104 is lowered. The sizing of the open micro porous structure can allow water 306 or any relatively applied liquid to be absorbed and retained within the pad 316' for a considerably long period as well. In an embodiment, one side of the pad 316' is disposed towards an ambient region 150, as shown in the figure, allowing provision for a company name, logo, etc., to be disposed on the outer facing portion, and the outer facing portion can be made water repellent as well. Correspondingly, the pad 316' can be treated through known agents, such as by being hydrophobically coated, for inhibiting bacterial and fungal growth over long periods of application. Such coatings, however, may be understood to be applied on a single side of the pad 316', over a limited surface area, so that the coating does not block a flow of air, enabling a consequent cooling of the hot side 104 through natural convection, while correspondingly allowing the company name, logo, etc., to be visibly disposed over the limited surface area.

Like the design discussed for the evaporative pad 316, the absorbent pad 316' can also be inserted or attached at the hot side 104 through a removable cartridge 319'. Accordingly, a bracket 321 ', disposed at the hot side 104 can include features similar to the slot 321, enabling the positioning of the pad 316' at the hot side 104. Clipping or snapping features could be incorporated with the bracket 321 ' to allow a reliable attachment of the pad 316' to the hot side 104. The structure, material, designs, and ways to manufacture such kind of pads and the related cartridges are well known to the skilled in the art, and thus will not be discussed further.

A sump, such as the sump 308, is also included. As discussed earlier, the sump 308 can be adapted to collect water 306 draining or dripping out of the absorbent pad 316', as shown, through sprinkles 336. Further, a circuit 334 can enable the collected water 306 in the sump 308 to be returned to a water accumulator 330, as depicted. A check valve 338 enables a unidirectional flow of water 306 through the circuit 334, allowing a flow of water to occur only from the sump 308 to the accumulator 330, and restricting a flow in the opposite way. The accumulator 330, in particular, may be a water collection chamber, as shown, and may be configured in such a way that it includes a pressure head because of a filled fluid. More so, a piping 332 allows water 306 to flow from the accumulator 330 to the absorbent pad 316' through the distributor 340.

During operation, water collected in the accumulator 330, having a pressure head, allows a flow of water 306 from the accumulator 330 to the absorbent pad 316', as shown through an arrow E. The water 306 reaches the distributor 340, where the water 306 distributes over the absorbent pad 316' through gravity, as shown. Such gravity feed of water into the pad 316' further enables a capillary action of the pad 316' to spread the water 306 throughout the pad 316', allowing a flow of air, through a natural convection process, across the pad 316' to cool the hot side 104, to which the pad 316' is attached. It is understood that, in such a case, both the passing air and water 306, being in touch with the hot side 104, forms a factor for lowering temperatures of the hot side 104. Water absorbed in the pad 316' eventually drains out through drainage measures provided at the bottom of the absorbent pad 316', or provided at the bottom of the cartridge 319', housing the pad 316'. Such drainage measures can be holes or openings. Further, the water 306 being collected in the sump 308 flows back into the accumulator 330 through the circuit 334 through a check valve 338.

In an embodiment, water 306 in the system 300a and 300b can be replaced with equivalent fluids. In particular, fluids that can replace water 306 may have properties, such as surface tension, viscosity, etc., similar or better to that of water, and may enable them to be pumped and distributed like water while cooling the hot side 104. Such fluids are well known to those skilled in the art, and thus the related aspects will not be discussed further.

In further embodiments, the systems 300a and 300b can include a controller (not shown), apart from the one disclosed above, that can be configured to activate and deactivate the thermoelectric cooling process of the systems 300a and 300b with a programmable dwell period. Herein, the dwell period is understood to be the period between two consecutive activations of the thermoelectric cooling process, when applied. By introducing such a programmable dwell period, the thermal balance between the cooling generated through the thermoelectric process of the systems 300a and 300b, and subsequently transferred to the cooling load 304, can be synchronized, saving energy in the overall cooling process.

The above discussed active and passive evaporative processes are understood through the concepts depicted in FIG. 4A and FIG. 4B. Furthermore, the FIG. 5 depicts a Psychro metric graph 500 that describes these concepts in further detail.

Accordingly, FIG. 4A depicts an active evaporative cooling concept 400a that can function as a methodology to lower the temperature of the hot side 104 employed within thermoelectric cooling systems. Further, the concept 400a includes the evaporative pad 316, as described before, to be disposed as shown. In particular, this method of cooling the hot side 104 includes the sump 308, and water pump 310, configured to pump the water 306 stored in the sump 308 through an arrangement of a piping 402, as depicted. Moreover, the piping 402 is configured to supply water 306 through a water distributor 404 over the evaporative pad 316, developing a wetted evaporative pad 316. In particular, the structure and functioning of the circuit 312, depicted in FIG. 3 A, is understood through the arrangement of the piping 402 and water distributor 404. Region 406 may be the region disposed within the first structure 317.

During operation, the pump 310 pumps the water 306, stored in the sump 308, through the piping 402 and distributes the water 306 over the evaporative pad 316, as shown. Water 306, flowing through the pores or opening of the evaporative pad 316, allows air passing over or across the pad 316 to be cooled down to a lower temperature, further enabling the hot side 104, around which the cooled air flows over, to drop in temperature below the ambient temperature. The passage of air, as noted, is enabled through the fan 314. The water 306, entering the evaporative pad 316, drains back into the sump 308 through holes or openings (not shown) configured at the bottom of the pad 316, or at the bottom of the cartridge 319 within which the pad 316 is positioned, the draining eventually forming a water circulation circuit. As disclosed above, air entering through the pad 316, shown through the arrow A, and assisted through the fan 314, cools down the temperature of the hot side 104, when the air flows beyond the pad 316. Accordingly the air represented through an arrow A' will be lower in temperature and higher in moisture content. More so, a relative humidity (RH) of the cooled air, represented through an arrow A', will also be higher, causing the air to become more saturated. Moreover, the water 306 draining out of the pad 316 will become cooler as well, along with this cooled air.

Likewise, an exemplary passive evaporative cooling concept 400b, shown in FIG. 4B, can function as an alternative to the active evaporative cooling concept 400a. Accordingly, the concept 400b includes structure, components and working similar, however, minimally different from the concept 400a. Such difference primarily includes the fan 314 as an option, and an alternate way of wetting the pad 316'. Particularly, the fan 314 can be completely avoided for such configurations, and air can be brought into the hot side 104 through a natural convection process. Further, the pad 316' incorporates a multitude of holes, making the pad 316' open and micro porous in structure, enabling the absorption of water 306 through a capillary action. Accordingly, as shown, the concept 400b may not include a water pump or a fan, like the ones discussed for the active evaporative cooling concept 400a, but may include the sump 308 and a water distributor 340, similar to the one already disclosed. Further, the concept 400b includes the accumulator 330 configured to accumulate water 306, as shown, and a circuit 334, connecting the sump 308 to the accumulator 330. Piping 332 provides for a passage of water 306 from the accumulator 330 to the absorbent pad 316' through the distributor 340.

During an operation of the passive evaporative cooling concept 400b, water 306, stored in the accumulator 330, includes a pressure head. Accordingly, the water 306 travels, as shown through the arrow E, into the water distributor 340 through the piping 332 as a result of the pressure head, and subsequently distributes over the pad 316', as shown. The distribution of the water 306 is similar to the one discussed in connection with the FIG. 4 A. Subsequently, the absorbent pad 316' absorbs the water 306 on contact, and distributes the water 306 through a capillary action all throughout the surface of the pad 316'. The water 306 flowing into the pad 316' further flows down into the sump 308 through holes or openings configured at the bottom of the pad 316', or at the bottom of the cartridge 319' that house the pad 316', from where the water 306 is directed back into the accumulator 330 through the circuit 334. In particular, the circuit 334 is configured to include a check valve 338 that allows a unidirectional flow of water 306 such that the water 306, stored in the accumulator 330, does not enter the sump 308, but rather the water 306 flows only from the sump 308 to the accumulator 330, as shown through the arrow F. It will be understood that any passage of air through the pad 316' is enabled through a natural convection process. Accordingly, when a quantity of air, shown through the arrow D, flowing through a natural convection process, flows into the pad 316', the air becomes saturated as it flows beyond the pad 316', shown through the arrow D'. Similar to the active evaporation concept 400a, the quantity of air obtained, having flown beyond the pad 316', includes higher moisture and a reduced temperature, accounting to an interaction with the wet pad 316'. Further, it is understood that an amount of water 306, draining out of the pad 316' will become cooler as well, along with the cooled air, represented through the arrow D'.

Further, the absorbent pad 316' can include a phase change material (PCM) that can solidify when an ambient temperature is low than when the ambient temperature is high. Such solidification of the PCM in the pad 316' can enhance a cooling capacity of the system 300b or the concept 400b, accounting to a flow of air across the pad 316' through a natural convection process. More so, such a configuration can particularly be applied when a difference between the ambient temperatures of the day and night is high.

The above noted concept of cooling the hot side 104 of the thermoelectric cooling through active and passive evaporative cooling processes can be understood in detail through a psychrometric graph 500, as shown in FIG .5. The graph 500, being well known to those skilled in the art, depicts a dry bulb temperature (°C) on the X-axis, and a corresponding humidity ratio (lb/lb of dry air) on the Y-axis. In particular, the curve 502 can be understood to be an exemplary WBT line of 15.5°C, curve 504 to be a curve depicting 80% relative humidity (RH), curve 506, the 100% saturation line, while curve 508 to be depicting 20%> RH. The graph 500 is not drawn to scale.

Herein, through the graph 500, the working concept of both the above discussed cooling methods, namely, active and passive evaporative cooling concepts 400a and 400b, respectively, is understood in further detail. Exemplary values of temperature, humidity ratio, etc., have been included to enable a better understanding of the concepts 400a and 400b. It is also understood that such values mentioned are exemplary in nature, and may not be precise in relation to the actual values.

Accordingly, an amount of ambient air configured to be directed towards the evaporative pad 316 or absorbent pad 316' can be at an exemplary dry bulb temperature of 30°C, having 20% (RH), and can have a corresponding WBT ranging around 15.5°C. The travel of air from the ambient region 150 to the hot side 104, through the evaporative pad 316 or the absorbent pad 316', enables the air to drop in the dry bulb temperature exemplarily from 30°C to region around 18.3°C. Such a drop is made possible because the air, passing through the pads 316 or 316', becomes saturated as a result of the water content present in the pads 316 or 316'. More so, such a saturation level change can exemplarily range from the initial 20% RH of ambient air, up to 90% RH for the air when the air passes beyond the pads 316 or 316'. Subsequently, it can be seen from the graph 500, that a relative change in the moisture content of air or the relative humidity ratio of the air varies as well. Such variations also can exemplarily range from an initial value of around 0.00525 lb/lb to an eventual value of around 0.01070 lb/lb of dry air or more, as depicted. Accordingly it could be understood that ambient air being directed inwards into the region 406 or the hot side 104 would showcase a change in the dry bulb temperature, through a reduction in heat accompanied by a change in mass, through an increase in the humidity ratio of the air. The cooled air, or water 306, is thus configured to flow around the hot side 104, lowering the temperatures of the hot side 104, and maintaining the first temperature of the hot side 104 below the ambient temperatures at all times. Cooling the cooling load 304 through either of the systems 300a and 300b, disclosed in the application, is thus enabled when the temperature of the hot side 104 falls below a temperature of the ambient region 150. Consequently, cooling capacity and related efficiencies in the thermoelectric cooler systems 300a and 300b, when working on the concepts 400a and 400b, is observed to improve.

Certain embodiments, that keep the hot side 104 at a lower temperature, can have either of the applications 350a or 350b to include a phase change material (PCM) to keep the first temperature of the hot side 104 lower than the ambient temperature, by solidifying when the ambient temperature is lower than when the ambient temperature is higher. The solidification and a corresponding storage of latent heat energy can be brought about during a normal cooling operation, and subsequently, the stored latent heat energy can be given out to cool, or absorb heat from the hot side 104, to keep the temperatures of the hot side 104 below an ambient temperature. Such absorption of heat will melt the PCM. This cycle of melting and subsequently solidifying of the PCM will help run such an embodiment on a continual basis.

The specification has set out a number of specific exemplary embodiments, but those skilled in the art will understand that variations in these embodiments will naturally occur in the course of embodying the subject matter of the disclosure in specific implementations and environments. It will further be understood that such variation and others as well, fall within the scope of the disclosure. Neither those possible variations nor the specific examples set above are set out to limit the scope of the disclosure. Rather, the scope of claimed invention is defined solely by the claims set out below.