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Patent Searching and Data


Title:
HOT STAMP MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/180853
Kind Code:
A1
Abstract:
A hot stamp molded body which is provided with a steel base material and a metal layer that is formed on the surface of the steel base material, and which is configured such that the metal layer comprises: an interface layer which is positioned at the interface with the steel base material and contains 30.0-36.0% by mass of Al, while having a thickness of from 100 nm to 15 μm; and a main layer which is positioned on the interface layer and has a structure wherein a Zn phase and island-like FeAl2 phases are mixed, while having a thickness of from 1 μm to 40 μm. This hot stamp molded body exhibits excellent fatigue characteristics, corrosion resistance and chipping resistance.

Inventors:
MITSUNOBU TAKUYA (JP)
TOKUDA KOHEI (JP)
SENGOKU AKIHIRO (JP)
MATSUMURA KENICHIRO (JP)
Application Number:
PCT/JP2018/011207
Publication Date:
September 26, 2019
Filing Date:
March 20, 2018
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C23C2/28; B21D22/20; B32B15/01; C22C18/00; C22C21/00; C22C30/06; C22C38/00; C23C2/06; C23C2/12; C23C8/12; C23C28/00
Foreign References:
JP2012112010A2012-06-14
JP2012041610A2012-03-01
JP2010018860A2010-01-28
JP2000038640A2000-02-08
JP2003049256A2003-02-21
JP2003073774A2003-03-12
JP2005113233A2005-04-28
JP2012112010A2012-06-14
Other References:
See also references of EP 3770296A4
Attorney, Agent or Firm:
BRIGHTAS IP ATTORNEYS (JP)
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