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Title:
HOT STAMP MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2020/189767
Kind Code:
A1
Abstract:
This hot stamp molded body has a predetermined chemical composition, the average grain diameter of old austenite grains in a micro structure is 5.0 μm or less, and the average concentration of Mn in grain boundaries of the old austenite grains is 1.0 mass% or less. This hot stamp molded body may have a plating layer on the surface thereof and a softened area in a portion thereof.

Inventors:
FUJINAKA SHINGO (JP)
TODA YURI (JP)
MAEDA DAISUKE (JP)
Application Number:
PCT/JP2020/012395
Publication Date:
September 24, 2020
Filing Date:
March 19, 2020
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C21D9/00; C21D1/18; C21D9/46; C22C38/00; C22C38/58
Domestic Patent References:
WO2018134874A12018-07-26
WO2019186928A12019-10-03
WO2018134874A12018-07-26
Foreign References:
JP2017043825A2017-03-02
JP2019052103A2019-04-04
JPS5030280B11975-09-30
JPS6132017B21986-07-24
JPS542191B21979-02-03
Other References:
See also references of EP 3943623A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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