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Title:
HOT-STAMP-MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2023/063048
Kind Code:
A1
Abstract:
This hot-stamp-molded object comprises a steel material and a plating layer. The chemical composition of the plating layer contains, in mass%, 0-70% of Al, 10-60% of Fe, 0-20% of Si, and a total of 0.00001-0.3% of a C-group element which is one or two of Li and Y, and optionally further contains one or more of Sb, Pb, B, Cu, Ti, Cr, Nb, Ni, Mn, Mo, Ag, Co, Sn, and Bi, the remaining portion being Zn impurities. In the plating layer, a η-Zn phase or a Zn-containing phase is included.

Inventors:
MITSUNOBU TAKUYA (JP)
HAYASHIDA SHOTA (JP)
TAKEBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2022/035441
Publication Date:
April 20, 2023
Filing Date:
September 22, 2022
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C23C2/06; C21D1/18; C21D1/26; C21D1/76; C21D9/00; C22C18/00; C22C18/04; C22C21/00; C22C21/10; C22C38/06; C22C38/14; C23C2/12; C23C2/28; C22C38/00; C22C38/04
Domestic Patent References:
WO2021039971A12021-03-04
WO2021171517A12021-09-02
WO2014171417A12014-10-23
WO2017017513A12017-02-02
WO2017017514A12017-02-02
Foreign References:
JP2021167251A2021-10-21
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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