Title:
HOT STAMPED MOLDING
Document Type and Number:
WIPO Patent Application WO/2018/179395
Kind Code:
A1
Abstract:
A hot stamped molding provided with a base metal 10 and a plating layer 20 formed on the surface of the base metal 10, wherein: the plating layer 20 comprises an interfacial layer 21, an intermediate layer 22 and an oxide layer 23, in that order starting from the side of the base metal 10; the structure of the interfacial layer 21 comprises at least one kind of Fe-Al alloy selected from αFe, Fe3Al and FeAl and the total area ratio of the Fe-Al alloy is at least 99%; the intermediate layer 22 comprises at least one kind of Fe-Al-Zn phase selected from Fe(Al,Zn)2, Fe2(Al,Zn)5 and Fe(Al,Zn)3 and the total area percentage of the Fe-Al-Zn phases is at least 50%; the mean composition, in mass%, comprises Al: 30-50% and Zn: 15-30%; and the mean film thickness of the oxide layer 23 is 3.0 µm or less and the Mg content is 0.05-0.50 g/m2.
Inventors:
SENGOKU AKIHIRO (JP)
TAKEBAYASHI HIROSHI (JP)
AKIOKA KOJI (JP)
MATSUMURA KENICHIRO (JP)
TAKEBAYASHI HIROSHI (JP)
AKIOKA KOJI (JP)
MATSUMURA KENICHIRO (JP)
Application Number:
PCT/JP2017/013760
Publication Date:
October 04, 2018
Filing Date:
March 31, 2017
Export Citation:
Assignee:
NIPPON STEEL & SUMITOMO METAL CORP (JP)
International Classes:
C23C2/12; C21D1/18; C21D9/00; C22C18/04; C22C21/10; C22C38/00; C22C38/06; C22C38/58; C23C2/28; C23C2/40
Foreign References:
JP2012112010A | 2012-06-14 | |||
JP2005113233A | 2005-04-28 | |||
JP2003073774A | 2003-03-12 | |||
JP2003049256A | 2003-02-21 | |||
JP2005113233A | 2005-04-28 |
Other References:
NISSHIN STEEL CORPORATION GROUP PRODUCT DEVELOPMENT STRATEGY HEADQUARTERS TECHNICAL RESEARCH INSTITUTE OKUGAKU: "Development trend of surface treated steel sheet for building materials", KAI NISHIYAMA KINEN GIJUTSU KOZA, vol. 223-224, October 2015 (2015-10-01), JAPAN, pages 67 - 68, XP009517879, ISSN: 1344-0934
See also references of EP 3604602A4
See also references of EP 3604602A4
Attorney, Agent or Firm:
BRIGHTAS IP ATTORNEYS (JP)
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