HOT STAMPING APPARATUS AND METHOD FOR PREVENTING PLATING FROM STICKING TO MOLD

Title:

HOT STAMPING APPARATUS AND METHOD FOR PREVENTING PLATING FROM STICKING TO MOLD

Document Type and Number:

WIPO Patent Application WO/2016/093410

Kind Code:

A1

Abstract:

Disclosed is a hot stamping apparatus and method for preventing plating from sticking to a mold. An aspect of the present invention may provide a hot stamping apparatus for preventing plating from sticking to a mold, the apparatus comprising a mold for receiving a heated plated material supplied thereto, pressure-molding the material, and rapidly cooling the material while the material is clamped in the mold, wherein, before the material is pressure-molded, a plating sticking inhibiting layer is formed on the surfaces of the mold, which are placed in contact with the plated material.

More Like This:

JP5421472	Tire stencil manufacturing equipment
WO/2016/078873	METHOD FOR PRODUCING A COMPONENT FROM DIFFERENT MATERIALS, AND COMPONENT AND USE THEREOF
JP7064334	Can body manufacturing equipment and manufacturing method

Inventors:

SHIN NAM-KYU (KR)
NAM SEUNG-MAN (KR)
LEE MYEONG-JIN (KR)
KIM YUN-TAE (KR)

Application Number:

PCT/KR2014/012327

Publication Date:

June 16, 2016

Filing Date:

December 15, 2014

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HYUNDAI STEEL CO (KR)

International Classes:

B21D22/02

Foreign References:

KR101033361B1	2011-05-09
KR20120048398A	2012-05-15
JP2006529002A	2006-12-28

Attorney, Agent or Firm:

DAE-A INTELLECTUAL PROPERTY CONSULTING (KR)
특허법인 대아 (KR)

Download PDF:

View/Download PDF PDF Help

Previous Patent: METHOD FOR CONTROLLING ELECTRONIC BOOK HAVING EMBEDDED CONTENT, AND APPARATUS THEREFOR

Next Patent: POSITIVE ELECTRODE FOR LITHIUM-AIR BATTERY, METHOD FOR MANUFACTURING SAME, AND LITHIUM-AIR BATTERY C...