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Title:
HOT STAMPING MOLD APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/132090
Kind Code:
A1
Abstract:
Proposed is a hot stamping mold apparatus having subassemblies each being configured such that a plurality of plates adjacently arranged in surface contact with each other. A first cooling channel is provided extending along the contact surfaces of adjacent plates by forming grooves corresponding to each other on the contact surfaces of the adjacent plates. At least one of the subassemblies is provided with a second cooling channel extending longitudinally through a corresponding subassembly.

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Inventors:
LEE HYUN WOO (KR)
YANG DAE HO (KR)
KIM JANG SOO (KR)
LEE TAE KYU (KR)
Application Number:
PCT/KR2017/015787
Publication Date:
July 04, 2019
Filing Date:
December 29, 2017
Export Citation:
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Assignee:
MS AUTOTECH CO LTD (KR)
International Classes:
B21D22/02; B21D37/16
Foreign References:
KR20130076484A2013-07-08
KR20170035754A2017-03-31
US20150107325A12015-04-23
KR20130050025A2013-05-15
JP5679057B22015-03-04
Attorney, Agent or Firm:
CHO, Young Hwan (KR)
Download PDF:
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