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Title:
HOT WATER SUPPLY DEVICE ASSOCIATED WITH HEAT PUMP
Document Type and Number:
WIPO Patent Application WO/2011/145780
Kind Code:
A1
Abstract:
Provided is a hot water supply device associated with a heat pump. In the hot water supply device, hot water supply is performed using a hight-temperature refrigerant discharged from a compressor. Also, an amount of a hot water supply side refrigerant and an amount of a cooling/heating side refrigerant are adjusted according to a hot water supply load and a cooling/heating load. Thus, hot water supply performance and heating performance are may be further improved.

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Inventors:
SIM JIE-SEOP (KR)
Application Number:
PCT/KR2010/006618
Publication Date:
November 24, 2011
Filing Date:
September 29, 2010
Export Citation:
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Assignee:
LG ELECTRONICS INC (KR)
SIM JIE-SEOP (KR)
International Classes:
F24H4/02; F24D3/18; F24D19/10
Foreign References:
KR860005195A1986-07-18
KR20070098514A2007-10-05
KR100468474B12005-01-27
KR20100046365A2010-05-07
JPS60259838A1985-12-21
Attorney, Agent or Firm:
HAW, Yong-Noke (832-41Yeoksam-dong, Gangnam-gu, Seoul 135-080, KR)
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