Title:
A HOTMELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/095816
Kind Code:
A1
Abstract:
To provide a hot melt adhesive having excellent coatability and adhesiveness to a member of a disposable product, excellent storage stability, and both having high natural resin use ratio and low odor; and a disposable product obtained by using the hot melt adhesive. A hot melt adhesive comprising (A) a thermoplastic block copolymer which is a copolymer of vinyl-type aromatic hydrocarbons and conjugated diene compounds, (B) a tackifying resin and (C) a wax, wherein the tackifying resin (B) comprises (B1) a natural resin having an acid value of 20 mg KOH/g or less.
Inventors:
SAITO SHIGEKAZU (JP)
Application Number:
PCT/JP2022/043274
Publication Date:
June 01, 2023
Filing Date:
November 24, 2022
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
C09J153/02; C08L93/04
Domestic Patent References:
| WO2021117853A1 | 2021-06-17 |
Foreign References:
| JP2016060847A | 2016-04-25 | |||
| US20210317346A1 | 2021-10-14 | |||
| JP2017186487A | 2017-10-12 | |||
| JP2018058940A | 2018-04-12 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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