Title:
HOTMELT APPLICATION SYSTEM AND PROCESS
Document Type and Number:
WIPO Patent Application WO/2022/072302
Kind Code:
A3
Abstract:
System and process that continuously circulates hotmelt adhesive at a circulating pressure rate to apply hotmelt adhesive to a moving substrate on a substrate delivery conveyor. The system includes an adhesive delivery line connected to an elongated manifold, the manifold including: (i) a main internal fluid pathway in fluid communication with the adhesive delivery line and an adhesive return line, and (ii) an elongated heater providing a substantially constant internal temperature to the elongated manifold. An adhesive pump transporting hotmelt adhesive from the adhesive reservoir to the adhesive delivery line under pressure, the adhesive reservoir including a filter that filters hotmelt adhesive. A plurality of hotmelt spray heads in fluid communication with the main internal fluid pathway to dispense hotmelt adhesive onto the moving substrate. The adhesive return line in fluid communication with the adhesive pump and/or the adhesive reservoir to transport hotmelt adhesive from the elongated manifold.
Inventors:
VAN DE HEY JOSEPH F (US)
ZIRBEL ALEX M (US)
KUFFEL ALEX N (US)
VANHANDEL JEFFERY J (US)
DANIELS GRANT D (US)
EBBEN SCOTT S (US)
ZIRBEL ALEX M (US)
KUFFEL ALEX N (US)
VANHANDEL JEFFERY J (US)
DANIELS GRANT D (US)
EBBEN SCOTT S (US)
Application Number:
PCT/US2021/052287
Publication Date:
July 14, 2022
Filing Date:
September 28, 2021
Export Citation:
Assignee:
C3 CORP (US)
International Classes:
B05C5/00; B29C67/02
Foreign References:
| US5458291A | 1995-10-17 | |||
| US20110014369A1 | 2011-01-20 | |||
| US20050015050A1 | 2005-01-20 | |||
| US6752323B1 | 2004-06-22 | |||
| US20050242108A1 | 2005-11-03 |
Attorney, Agent or Firm:
BENDEL, Michael J. (US)
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