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Patent Searching and Data


Title:
HOUSING ASSEMBLY, ANTENNA ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/000732
Kind Code:
A1
Abstract:
Provided are a housing assembly, an antenna assembly and an electronic device. The housing assembly comprises a dielectric substrate and a coupled structure, wherein the dielectric substrate has a first transmittance rate for a radio-frequency signal with a preset dual band; the coupled structure is borne on the dielectric substrate, and at least covers a partial region of the dielectric substrate; the coupled structure comprises one or more coupling element array layers; the coupling element array layers have resonance characteristics under the preset dual band; the housing assembly has, in a region corresponding to the coupled structure, a second transmittance rate for the radio-frequency signal with the preset dual band; and the second transmittance rate is greater than the first transmittance rate.

Inventors:
JIA YUHU (CN)
Application Number:
PCT/CN2020/096619
Publication Date:
January 07, 2021
Filing Date:
June 17, 2020
Export Citation:
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Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H01Q1/38; H01Q1/22; H01Q1/50; H01Q1/52; H01Q5/50
Foreign References:
CN111276792A2020-06-12
CN110635242A2019-12-31
CN102637926A2012-08-15
CN102637926A2012-08-15
CN205050995U2016-02-24
CN208352525U2019-01-08
CN109103589A2018-12-28
CN102664313A2012-09-12
EP3361571A12018-08-15
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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