Title:
HOUSING ASSEMBLY, METHOD FOR MANUFACTURING HOUSING ASSEMBLY, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/207699
Kind Code:
A1
Abstract:
A housing assembly, a method for manufacturing a housing assembly, and an electronic apparatus. The housing assembly comprises: a substrate, which comprises a first surface and a second surface arranged opposite each other, wherein the first surface of the substrate is close to the electronic apparatus, and the substrate is hot-pressed and formed by means of soaking a glass fiber cloth in epoxy resin glue solution; a first decorative layer, which is provided on the first surface of the substrate; a light shielding layer, which is provided on the surface of the first decorative layer away from the substrate; and a second decorative layer, which is provided on the second surface of the substrate. The substrate uses a glass fiber epoxy resin plate, thus having high strength, high modulus, and light and thin material; and due to having high transparency, the two surfaces of the substrate can both be provided with a decorative layer, achieving a better decorative effect.
More Like This:
JPH07314598 | BUILDING DECORATIVE SHEET |
JPH0762307 | [Title of Invention] Fiber Mold |
Inventors:
YANG XUTONG (CN)
XING TIANYI (CN)
XING CHONG (CN)
XING TIANYI (CN)
XING CHONG (CN)
Application Number:
PCT/CN2023/089179
Publication Date:
November 02, 2023
Filing Date:
April 19, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
B32B17/02; B32B17/06; B32B27/38; H04M1/02
Foreign References:
CN114899539A | 2022-08-12 | |||
CN113878952A | 2022-01-04 | |||
CN110901110A | 2020-03-24 | |||
CN111263545A | 2020-06-09 | |||
CN112848563A | 2021-05-28 | |||
JP2015044325A | 2015-03-12 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
Download PDF: