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Patent Searching and Data


Title:
HOUSING ASSEMBLY, PROCESSING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/244356
Kind Code:
A1
Abstract:
A housing assembly (10), a processing method therefor, and an electronic device (100). The housing assembly (10) comprises: a substrate (1), which is provided with an inner surface and an outer surface which are arranged opposite to each other, the substrate (1) being a transparent piece; a touch layer (2), which is provided at the inner surface of the substrate (1), the touch layer (2) being suitable for electrically connecting to a motherboard (20) of the electronic device (100); and a decorative layer (10a), which is provided at a side surface of the touch layer (2) away from the substrate (1).

Inventors:
YANG GUANGMING (CN)
Application Number:
PCT/CN2020/089700
Publication Date:
December 10, 2020
Filing Date:
May 12, 2020
Export Citation:
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Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H05K5/00; G06F3/041; H05K5/02
Foreign References:
CN110290653A2019-09-27
CN208827232U2019-05-07
CN208827232U2019-05-07
CN108382043A2018-08-10
CN104699336A2015-06-10
CN208828422U2019-05-07
US10289166B12019-05-14
CN201594252U2010-09-29
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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