HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE

Title:

HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE

Document Type and Number:

WIPO Patent Application WO/2023/179090

Kind Code:

A1

Abstract:

Disclosed is a hybrid bond sheet (200) for mounting a semiconductor power module (310) to a heat sink (320)，the hybrid bond sheet (200) comprising: a thermally conductive core layer (210) having an upper main face (210a) and a lower main face (210b) opposing the upper main face (210a); a first bond layer (220) formed at the upper main face (210a) of the core layer (210) for bonding the hybrid bond sheet (200) to a semiconductor power module (310); and a second bond layer (230) formed at the lower main face (210b) of the core layer (210) for bonding the hybrid bond sheet (200) to a heat sink (320); wherein the core layer (210) is subdivided into a plurality of core metal sections (212) and core polymer sections (211) which are formed side-by-side between the upper main face (210a) and the lower main face (210b), the subdivided core metal sections (212) being configured to enable a uniform heat transfer between the semiconductor power module (310) and the heat sink (320) and to reduce thermal stress at interfaces between the hybrid bond sheet (200) and the heat sink (320).

More Like This:

WO/2013/116999	METHOD AND APPARATUS FOR REDUCING THE MECHANICAL STRESS WHEN MOUNTING ASSEMBLIES WITH THERMAL PADS
WO/2018/118315	SEMICONDUCTOR DIE ASSEMBLY HAVING HEAT SPREADER THAT EXTENDS THROUGH UNDERLYING INTERPOSER AND RELATED TECHNOLOGY
WO/2000/035010	HEAT EXCHANGER THAT CONTACTS AN ENTIRE PLANAR FACE OF AN ELECTRONIC DEVICE EXCEPT FOR ITS CORNERS

Inventors:

MUNDING ANDREAS (DE)
LIU YUMIN (CN)
PALM LASSE PETTERI (DE)

Application Number:

PCT/CN2022/136929

Publication Date:

September 28, 2023

Filing Date:

December 06, 2022

Export Citation:

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Assignee:

HUAWEI DIGITAL POWER TECH CO LTD (CN)

International Classes:

H01L23/367; H01L23/485

Foreign References:

US20200091113A1	2020-03-19
CN114203683A	2022-03-18
CN108695166A	2018-10-23
CN108695176A	2018-10-23
US20190229083A1	2019-07-25

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