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Title:
HYBRID BONDING INSULATION FILM-FORMING MATERIAL, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/195202
Kind Code:
A1
Abstract:
This hybrid bonding insulation film-forming material contains a thermosetting polyamide having a phenolic hydroxyl group in each molecule, and a solvent.

Inventors:
YONEDA SATOSHI (JP)
ADACHI KENYA (JP)
KOBAYASHI KAORI (JP)
MATSUKAWA DAISAKU (JP)
Application Number:
PCT/JP2022/045898
Publication Date:
October 12, 2023
Filing Date:
December 13, 2022
Export Citation:
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Assignee:
HD MICROSYSTEMS LTD (JP)
International Classes:
H01L21/60; G03F7/004; G03F7/023; G03F7/027; G03F7/037; H01L21/304; H01L23/29; H01L23/31
Domestic Patent References:
WO2016001949A12016-01-07
Foreign References:
JP2021197430A2021-12-27
JP2012188633A2012-10-04
JP2014052592A2014-03-20
JP2016009159A2016-01-18
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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