HYBRID BONDING STRUCTURE AND PREPARATION METHOD THEREFOR

Title:

HYBRID BONDING STRUCTURE AND PREPARATION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2023/116634

Kind Code:

A1

Abstract:

Disclosed are a hybrid bonding structure and a preparation method therefor. The hybrid bonding structure comprises a first substrate and a second substrate which are oppositely arranged, and a first bonding layer and a second bonding layer are respectively arranged on the first substrate and the second substrate, and the first bonding layer and the second bonding layer are bonded to form a bonding interface; the first bonding layer and/or the second bonding layer are provided with a copper bonding point with a preferred orientation of (110) crystal face, the copper bonding point comprises a twin structure which comprises twin lamellae, and the twin lamellae are mainly distributed along the crystal grain growth direction at an included angle of 45º; the proportion of the crystal grains with the twin lamellae in the total number of the crystal grains of the copper bonding point is greater than or equal to 50%, and/or the ratio of the volume of the twin structure to the total volume of the copper bonding point is greater than or equal to 50%. The hybrid bonding structure of the present invention can effectively improve the bonding force between chips; and meanwhile ensure better electrical connection; furthermore, the copper bonding point has excellent structure thermal stability and mechanical performance, which improves the service reliability.

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Inventors:

LIU ZHIQUAN (CN)
LI XIAO (CN)
LI ZHE (CN)
GAO LIYIN (CN)
SUN RONG (CN)

Application Number:

PCT/CN2022/140072

Publication Date:

June 29, 2023

Filing Date:

December 19, 2022

Export Citation:

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Assignee:

SHENZHEN INST OF ADV TECH CAS (CN)

International Classes:

H01L23/488; C25C1/12; C25D7/12; H01L21/60; H01L21/603

Foreign References:

CN114220783A	2022-03-22
CN110707069A	2020-01-17
CN113621999A	2021-11-09
US20170040272A1	2017-02-09
CN112779572A	2021-05-11

Attorney, Agent or Firm:

BEIJING ZHONG XUN TONG DA INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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