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Title:
HYDROGEL BONE VOID FILLER
Document Type and Number:
WIPO Patent Application WO2006053212
Kind Code:
A3
Abstract:
A bone void filler material, including a hydrogel component provided by microparticulates of pre-set hydrogel material dispersed within a carrier component to maintain the microparticulates substantially proximate to one another so that the resulting fill material is rendered as a substantially flowable mass.

Inventors:
EMBRY JILL M (US)
Application Number:
PCT/US2005/040915
Publication Date:
October 12, 2006
Filing Date:
November 09, 2005
Export Citation:
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Assignee:
MEDTRONIC INC (US)
International Classes:
A61L27/52
Domestic Patent References:
WO2004043438A12004-05-27
WO2004098756A22004-11-18
WO2005115488A22005-12-08
Foreign References:
US6030635A2000-02-29
US4631188A1986-12-23
EP1418188A22004-05-12
EP1642602A22006-04-05
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