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Title:
HYDROGEL PATCH FOR WOUND HEALING PROMOTION OR SCAR MINIMIZATION
Document Type and Number:
WIPO Patent Application WO/2024/029993
Kind Code:
A1
Abstract:
The present invention relates to a hydrogel patch for wound healing promotion or scar minimization. The use of the hydrogel patch composed of a biocompatible polymer modified with pyrogallol and containing a drug mixture in which PTD-DMB or PTD-DMB and valproic acid are mixed increases the content of collagen III, which is important for regenerative wound healing and scar mitigation, and the levels of dermal stem cell maker CD105 and angiogenesis marker CD31 at the wound site, thus promoting wound healing and minimizes scarring.

Inventors:
CHOI KANG-YELL (KR)
LEE SOUNG-HOON (KR)
KANG MIN-JEONG (KR)
CHO SEUNG-WOO (KR)
AN SOOHWAN (KR)
Application Number:
PCT/KR2023/011505
Publication Date:
February 08, 2024
Filing Date:
August 04, 2023
Export Citation:
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Assignee:
CK REGEON INC (KR)
UIF UNIV INDUSTRY FOUNDATION YONSEI UNIV (KR)
International Classes:
A61K9/70; A61K8/02; A61K8/36; A61K8/64; A61K8/73; A61K38/10; A61K47/12; A61K47/36; A61P17/02; A61Q19/00
Domestic Patent References:
WO2022131772A12022-06-23
Foreign References:
KR20210007071A2021-01-20
KR101721028B12017-03-29
KR20220029249A2022-03-08
Other References:
LEE SOUNG-HOON, KIM MI-YEON, KIM HYUN-YI, LEE YOUNG-MI, KIM HEESU, NAM KYOUNG AE, ROH MI RYUNG, MIN DO SIK, CHUNG KEE YANG, CHOI K: "The Dishevelled-binding protein CXXC5 negatively regulates cutaneous wound healing", JOURNAL OF EXPERIMENTAL MEDICINE, ROCKEFELLER UNIVERSITY PRESS, US, vol. 212, no. 7, 29 June 2015 (2015-06-29), US , pages 1061 - 1080, XP093135718, ISSN: 0022-1007, DOI: 10.1084/jem.20141601
LEE SOUNG‐HOON, AN SOOHWAN, RYU YEONG CHAN, SEO SEOL HWA, PARK SOHYUN, LEE MI JEONG, CHO SEUNG‐WOO, CHOI KANG‐YELL: "Adhesive Hydrogel Patch‐Mediated Combination Drug Therapy Induces Regenerative Wound Healing through Reconstruction of Regenerative Microenvironment", ADVANCED HEALTHCARE MATERIALS, WILEY - V C H VERLAG GMBH & CO. KGAA, DE, vol. 12, no. 18, 1 July 2023 (2023-07-01), DE , XP093135720, ISSN: 2192-2640, DOI: 10.1002/adhm.202203094
Attorney, Agent or Firm:
CHUNG HYUN PATENT & LAW FIRM (KR)
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