Title:
HYDROGEN FLUORIDE GAS REMOVAL DEVICE AND HYDROGEN FLUORIDE GAS REMOVAL METHOD
Document Type and Number:
WIPO Patent Application WO/2022/185879
Kind Code:
A1
Abstract:
Provided is a hydrogen fluoride gas removal device which is insusceptible to adhesion of a removal agent when performing a removal process to remove hydrogen fluoride gas from a mixed gas containing hydrogen fluoride gas by using the removal agent. The hydrogen fluoride gas removal device can remove hydrogen fluoride gas from a mixed gas containing the hydrogen fluoride gas and another type of gas. This hydrogen fluoride gas removal device comprises: a hydrogen fluoride gas removal processing unit (10) which performs a process to remove hydrogen fluoride gas from a mixed gas by bringing the mixed gas into contact with a removal agent for removing the hydrogen fluoride gas from the mixed gas; a removal agent supplying unit (20) which supplies the removal agent to the hydrogen fluoride gas removal processing unit (10); a removal agent moving unit which moves the removal agent stored in the hydrogen fluoride gas removal processing unit (10) inside the hydrogen fluoride gas removal processing unit (10); and a removal agent discharging unit which discharges the used removal agent from the hydrogen fluoride gas removal processing unit (10).
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Inventors:
KANAUCHI RIKU (JP)
FUKUCHI YOHSUKE (JP)
KOBAYASHI HIROSHI (JP)
FUKUCHI YOHSUKE (JP)
KOBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2022/005422
Publication Date:
September 09, 2022
Filing Date:
February 10, 2022
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
B01D53/08; B01J20/04; C01B7/19; B01J20/34
Domestic Patent References:
WO2013058211A1 | 2013-04-25 |
Foreign References:
CN111729468A | 2020-10-02 | |||
JPS4813273A | 1973-02-19 | |||
JP2013086054A | 2013-05-13 | |||
JP2005000854A | 2005-01-06 | |||
JP3170741U | 2011-09-29 | |||
US20080050298A1 | 2008-02-28 | |||
CN107441883A | 2017-12-08 | |||
JP2011017077A | 2011-01-27 | |||
JP2011208276A | 2011-10-20 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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