HYDROUS CUTTING FLUID FOR SLICING SILICON INGOT

WIPO Patent Application WO/2012/132448

A1

The present invention provides a cutting fluid which, in the step of cutting a silicon ingot, is superior to conventional products in the removal of processing heat, infiltrating property, inhibition of reaction between water and the silicon, and antifoaming property to thereby attain an improvement in cutting efficiency, and with which silicon wafers having satisfactory flatness are yielded. The accuracy of the processed surface can hence be kept high even under severe slicing conditions. The cutting fluid is a hydrous cutting fluid for silicon-ingot slicing, characterized by comprising a polyoxyalkylene adduct (A) of a compound (a) having 3-8 hydroxy groups, the adduct (A) being represented by general formula (1), and water as essential components, the polyoxyalkylene adduct (A) having an HLB of 6.0-20.0. R{O-(A1O)m-H}f (1) [In formula (1), R represents the residue formed by removing the hydroxyl groups from a compound having 3-8 hydroxy groups; (A1O) represents a C2-4 oxyalkylene; m, indicating the average number of moles of a C2-4 alkylene oxide which has added, is a number of 1-350; and f is an integer of 3-8.]

FUKUSHIMA TSUYOSHI (JP)
KATSUKAWA YOSHITAKA (JP)
YAMASHITA SEIJI (JP)

PCT/JP2012/002176

October 04, 2012

March 29, 2012

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SANYO CHEMICAL IND LTD (JP)
FUKUSHIMA TSUYOSHI (JP)
KATSUKAWA YOSHITAKA (JP)
YAMASHITA SEIJI (JP)

C10M173/02; B24B27/06; B24B37/00; C10M107/34; C11D1/722; C11D17/08; H01L21/304; C10N30/00; C10N30/04; C10N30/18; C10N40/22; C11D3/12

WO2011024486A1

2011-03-03

JP2003082336A	2003-03-19
JP2005179630A	2005-07-07
JP2002226879A	2002-08-14
JP2008173730A	2008-07-31
JP2010254813A	2010-11-11

SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)

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