Title:
HYDROXY RESIN, STYRENE RESIN, METHOD FOR PRODUCING HYDROXY RESIN, METHOD FOR PRODUCING STYRENE RESIN, AND APPLICATIONS THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/176765
Kind Code:
A1
Abstract:
Provided is a styrene resin which can give cured objects excellent in terms of low-dielectric characteristics (Dk and/or Df) and heat resistance. Also provided are a hydroxy resin, a method for producing the hydroxy resin, a method for producing the styrene resin, and a resin composition, a cured object, a prepreg, a metal-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device each including or obtained using the styrene resin. The hydroxy resin is represented by formula (T-OH) and has a number-average molecular weight of 850-4,000. In formula (T-OH), R is a group including constituent units represented by formula (Tx-OH).
Inventors:
MIYAMOTO MAKOTO (JP)
FUTAMURA KEISUKE (JP)
FUTAMURA KEISUKE (JP)
Application Number:
PCT/JP2023/009587
Publication Date:
September 21, 2023
Filing Date:
March 13, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G61/02; B32B15/04; B32B27/00; C08J5/24; H05K1/03
Foreign References:
| US4205160A | 1980-05-27 | |||
| JPH03252441A | 1991-11-11 | |||
| JPH02219809A | 1990-09-03 | |||
| JPS61145223A | 1986-07-02 | |||
| JPH06172242A | 1994-06-21 | |||
| JP2021130741A | 2021-09-09 | |||
| JP2021143333A | 2021-09-24 | |||
| JP2007311732A | 2007-11-29 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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