IC CHIP MOUNTING BOARD, SUBSTRATE FOR MOTHER BOARD, DEVICE FOR OPTICAL COMMUNICATION, METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING IC CHIP THEREON, AND METHOD FOR MANUFACTURING SUBSTRATE FOR MOTHER BOARD

Title:

Document Type and Number:

WIPO Patent Application WO/2005/052666

Kind Code:

A1

Abstract:

A board for mounting an IC chip thereon is excellent in reliability. On the board, an optical signal passing region is formed thereby to suppress the transmission loss of an optical signal and to transmit the optical signal more reliably. This board comprises a conductor circuit and an insulating layer formed in multilayer on either side thereof, and further comprises an optical device mounted thereon. The board is characterized by having an optical signal passing region and a microlens disposed at the opposite end of the optical signal passing region to the end where the optical device is mounted.

Inventors:

ASAI MOTOO (JP)
KODAMA HIROAKI (JP)

Application Number:

PCT/JP2004/013971

Publication Date:

June 09, 2005

Filing Date:

September 24, 2004

Export Citation:

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Assignee:

IBIDEN CO LTD (JP)
ASAI MOTOO (JP)
KODAMA HIROAKI (JP)

International Classes:

G02B6/43; H01L31/0203; H01L31/0232; H05K1/02; H05K3/46; (IPC1-7): G02B6/42; G02B6/32; H01L27/15; G02B3/00; H01L31/02; H01S5/022; H01L33/00

Foreign References:

JP2002329891A	2002-11-15
JP2000147275A	2000-05-26
JPH0555633A	1993-03-05
JP2002331532A	2002-11-19
JP2002120230A	2002-04-23

Other References: