Title:
IC DISK BOX
Document Type and Number:
WIPO Patent Application WO/2016/127623
Kind Code:
A1
Abstract:
An IC disk box comprises a box body (10) provided with a hollowed-out structure (11) and comprises an ejection mechanism (20). The ejection mechanism (20) comprises a substrate (23), and comprises a raised structure (24) for ejecting an IC wafer. The raised structure (24) is disposed on the substrate (23), is slidably assembled in the hollowed-out structure (11). The hollowed-out structure (11) and the raised structure (24) form a groove body structure for placing the IC wafer. In use, the raised structure (24) of the ejection mechanism (20) slides towards the interior of the hollowed-out structure (11), so that the IC wafer placed in the groove body structure is ejected, which helps to take out and turn over the IC wafer and also improves the safety of processing the IC wafer.
Inventors:
XING YANG (CN)
Application Number:
PCT/CN2015/088202
Publication Date:
August 18, 2016
Filing Date:
August 27, 2015
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
A45C11/24
Foreign References:
| CN104605599A | 2015-05-13 | |||
| CN102512820A | 2012-06-27 | |||
| CN103692479A | 2014-04-02 | |||
| CN203086868U | 2013-07-24 | |||
| JP2004358579A | 2004-12-24 |
Other References:
See also references of EP 3257394A4
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
北京市柳沈律师事务所 (CN)
北京市柳沈律师事务所 (CN)
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