Title:
IC INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/093527
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an IC inspection device in which the electrical distance between an IC to be inspected and a bypass capacitor is less than in the prior art and which is maintenance-free. In order to achieve this purpose, the present invention is provided with an IC inspection device that inspects the electrical characteristics of an IC to be inspected, wherein the IC inspection device is characterized by being provided with an inspection circuit substrate and an interposer that relays between the IC to be inspected and the inspection circuit substrate, the interposer comprising a rigid substrate with which a lead terminal of the IC to be inspected comes into contact, and the rigid substrate being provided with a bypass capacitor.
Inventors:
WADA IZUMI (JP)
YOSHINAGA MOTOHIDE (JP)
YOSHINAGA MOTOHIDE (JP)
Application Number:
PCT/JP2018/042030
Publication Date:
May 16, 2019
Filing Date:
November 13, 2018
Export Citation:
Assignee:
LEAD ELECTRONICS CO LTD (JP)
International Classes:
G01R31/26; G01R1/073; G01R31/28; H01R33/76
Foreign References:
| JPH0562748A | 1993-03-12 | |||
| JP2012220438A | 2012-11-12 | |||
| JP2008089461A | 2008-04-17 | |||
| JP2013504894A | 2013-02-07 |
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (JP)
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