Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
IC TAG
Document Type and Number:
WIPO Patent Application WO/2013/157525
Kind Code:
A1
Abstract:
The present invention suppresses breakage of an IC tag at a higher probability, while ensuring flexibility of the IC tag as a whole. An IC tag (100) is provided with a covering section (140), which covers at least an IC tag (100) surface where an IC chip (130) is mounted, which has a portion (140a) formed thicker than a portion (140b) covering an area outside of the periphery of the IC chip (130), said portion (140a) covering the peripheral area of the IC chip (130), and which is formed of an elastic material. Furthermore, the covering section (140) is formed such that at least a part of a boundary portion between the portion (140a) covering the peripheral area of the IC chip (130), and the portion (140b) covering the area outside of the periphery of the IC chip (130) has a bent shape.

Inventors:
NAKANO TOMOKO (JP)
FUJISAWA NAOHIRO (JP)
MIYAJIMA KEIICHI (JP)
MINOSHIMA KENJI (JP)
Application Number:
PCT/JP2013/061215
Publication Date:
October 24, 2013
Filing Date:
April 15, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NOK CORP (JP)
International Classes:
G06K19/077; G06K19/07
Domestic Patent References:
WO2008047436A12008-04-24
Foreign References:
JP2009116670A2009-05-28
JP2012212198A2012-11-01
JP2008299465A2008-12-11
JP2005056362A2005-03-03
JP2007148735A2007-06-14
JP2007004323A2007-01-11
JP2010122764A2010-06-03
JP2010250504A2010-11-04
JP2009277256A2009-11-26
JP2000148948A2000-05-30
JP2010067116A2010-03-25
Other References:
See also references of EP 2840531A4
Attorney, Agent or Firm:
SERA Kazunobu et al. (JP)
Kazunobu Sera (JP)
Download PDF: