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Patent Searching and Data


Title:
IC TAGGED COMPOUND CONTAINER LID
Document Type and Number:
WIPO Patent Application WO/2014/002971
Kind Code:
A1
Abstract:
This compound container lid is a packaging container comprising an inner cap (30) fixed to a container opening (20), an over cap (40) provided over the inner cap (30), and an IC tag (10); wherein an engaging means is provided between the inner surface of a skirt (42) of the over cap (40) and the outer surface of a cylindrical wall (32) of the inner cap (30); the IC tag (10) is composed of a resin film (1) comprising an IC chip (3), an antenna (5), and a broken seal detection circuit (9); and the IC tag (10) is attached to the inner cap (30) or the over cap (40) so that the broken seal detection circuit (9) is ruptured by the relative movement of the over cap (40) and the inner cap (30) occurring during the process leading up to the opening of the inner cap (30).

Inventors:
ARAI TOSHIYUKI (JP)
KUROSAWA TAKAHIRO (JP)
KIKUCHI TAKAYUKI (JP)
SAHARA TORU (JP)
SUGI MAMIKO (JP)
Application Number:
PCT/JP2013/067303
Publication Date:
January 03, 2014
Filing Date:
June 25, 2013
Export Citation:
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Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
NIPPON CLOSURES CO LTD (JP)
International Classes:
B65D55/02; B65D51/24; G06K19/07
Foreign References:
US20080314900A12008-12-25
JPH08511225A1996-11-26
JP2009001326A2009-01-08
JP2011227752A2011-11-10
JP2011213378A2011-10-27
JP3182220U2013-03-14
JP2005321935A2005-11-17
JP4047821B22008-02-13
JP2011213378A2011-10-27
Other References:
See also references of EP 2865607A4
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
Ono Pure in addition (JP)
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