IC TYPE JUMPER PACKAGE AND PRINTED CIRCUIT BOARD HAVING SAME

Title:

IC TYPE JUMPER PACKAGE AND PRINTED CIRCUIT BOARD HAVING SAME

Document Type and Number:

WIPO Patent Application WO/2024/043418

Kind Code:

A1

Abstract:

Disclosed are an IC type jumper package which can greatly increase the freedom of wiring design even when using a single-sided printed circuit board, and a printed circuit board having same. The jumper package comprises one or more conductive lead frames each isolated and insulated inside an epoxy molding compound.

Inventors:

KIM MIN SEON (KR)
KIM YONG GEUN (KR)

Application Number:

PCT/KR2023/001287

Publication Date:

February 29, 2024

Filing Date:

January 27, 2023

Export Citation:

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Assignee:

GLOBAL TECH CO LTD (KR)

International Classes:

H01L23/495; H01L23/29; H01L23/31; H05K1/18

Foreign References:

JP2008300588A	2008-12-11
KR20020052930A	2002-07-04
JPH0823066A	1996-01-23
KR20050100656A	2005-10-19
JPH0922925A	1997-01-21

Attorney, Agent or Firm:

LEE, Cheol Hee (KR)

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