TECHNICAL FIELD

[0001 ] The present disclosure relates to shields for deposition systems and to deposition systems configured for depositing an evaporated material, particularly an evaporated organic material, on one or more substrates. Embodiments of the present disclosure further relate to an idle shield configured to shield, block, and/or collect evaporated material, for example, in an idle position of a deposition source. Embodiments of the present disclosure further relate to a deposition apparatus with a deposition system for depositing an evaporated material on a substrate. Further embodiments relate to methods of operating an evaporation source, methods of assembling an idle shield, and methods of operating a deposition system, particularly for depositing an evaporated material on a substrate in a vacuum processing chamber.

BACKGROUND

[0002] Organic evaporators are a tool for the production of organic light-emitting diodes (OLED). OLEDs are a special type of light-emitting diode in which the emissive layer comprises a thin-film of certain organic compounds. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, e.g. for displaying information. OLEDs can also be used for general space illumination. The range of colors, brightness and viewing angles of OLED displays may be greater than that of traditional LCD displays because OLED pixels directly emit light and do not involve a back light. Therefore, the energy consumption of OLED displays is considerably less than that of traditional LCD displays. Further, the fact that OLEDs can be manufactured onto flexible substrates results in further applications.

[0003] Typically, the evaporated material is directed toward the substrate by one or more outlets of a vapor source. For example, the vapor source may be provided with a plurality of nozzles that are configured for directing plumes of evaporated material toward the substrate. The vapor source may be moved relative to the substrate for coating the substrate with the evaporated material.

[0004] A stable plume of evaporated material from the one or more vapor outlets of the vapor source may be beneficial, in order to deposit a material pattern with a predetermined uniformity on the substrate. After start-up of the vapor source, it may take some time for the vapor source to stabilize. A frequent shut-down and start-up of the vapor source may therefore not be desired, and the vapor source may be kept running also in idle periods. There may be a risk that, during such idle periods, a wall of the vacuum processing chamber may get coated by evaporated material (“sprinkle coating”).

[0005] Further, it is beneficial to subsequently deposit various substrates, i.e. without unnecessary pausing of evaporation between processing of subsequent substrates. For example, the evaporation source may rotate to switch between substrate processing in the first deposition area and a second deposition area opposite the first deposition area. During rotation from the first deposition area to the second deposition area, the wall of the vacuum processing chamber may also get coated by evaporated material.

[0006] Accordingly, it would be beneficial to provide an idle shield for a deposition apparatus, deposition apparatus, and a deposition system configured for depositing an evaporated material on a substrate in an accurate manner, while reducing a sprinkle coating on surfaces of the apparatus or system.

SUMMARY

[0007] In view of the above, a shield for shielding material of a deposition source, deposition apparatus for depositing substrates subsequently in a vacuum chamber, a method of assembling a shield for shielding material of a deposition source, and a method of accessing a deposition source of a deposition apparatus having a vacuum chamber are provided. Further advantages, features, aspects and details are apparent from the dependent claims, the description and drawings.

[0008] According to one embodiment, a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber is provided. The shield includes a frame configured to be mounted to the deposition apparatus; a shield assembly coupled to the frame, including: a first side shield portion; a second side shield portion; and a center shield portion between the first side shield portion and the second side shield portion, the shield assembly being configured to be arranged between a wall of the vacuum chamber and the deposition source to shield deposition material in a closed position of the shield assembly; the shield further including: a door arrangement configured to move at least a portion of the shield assembly to allow access to the deposition source in an open position of the shield assembly.

[0009] According to one embodiment, a deposition apparatus for depositing substrates subsequently in a vacuum chamber is provided. The deposition apparatus includes a first substrate processing position adjacent a first side wall of the vacuum chamber; a second substrate processing position adjacent a second side wall of the vacuum chamber, the second side wall being opposite the first side wall; a deposition source between the first substrate processing position and the second substrate processing position; a source cart configured to translate the deposition source between the first substrate processing position and the second substrate processing position; an actuator configured to rotate the deposition source between a first direction depositing material on a substrate at the first substrate processing position and a second direction depositing material on a substrate at the second substrate processing position; and a shield according to any of the embodiments described herein.

[0010] According to one embodiment, a method of assembling a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber is provided. The method includes guiding a recess of a tile over a pin coupled to a screw; and fixing the tile to a plate assembly or a frame by applying torque to the screw.

[0011] According to one embodiment, a method of accessing a deposition source of a deposition apparatus having a vacuum chamber is provided. The method includes opening a door arrangement of a shield assembly arranged between a wall of the vacuum chamber and the deposition source to shield deposition material in a closed position of the door arrangement.

[0012] The disclosure is also directed to an apparatus for carrying out the disclosed methods including apparatus parts for performing the methods. The method may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, the disclosure is also directed to operating methods of the described apparatus. The disclosure includes a method for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] So that the manner in which the above recited features of the disclosure described herein can be understood in detail, a more particular description, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

[0014] FIG. 1A and FIG. IB show schematic views of a deposition apparatus according to embodiments described herein in a deposition position (FIG. 1 A) and in an idle position (FIG. IB);

[0015] FIG. 2 shows a perspective view of a shield of a deposition apparatus according to embodiments described herein;

[0016] FIG. 3 shows a schematic sectional view of a part of a deposition apparatus according to embodiments described herein;

[0017] FIG. 4A shows a perspective view of a shield of a deposition apparatus according to embodiments described herein;

[0018] FIG. 4B shows an enlarged view of a tile of a shield for a deposition apparatus according to embodiments described herein;

[0019] FIGS. 5 A and 5B show schematic views of a portion of a shield for a deposition apparatus according to embodiments described herein and illustrating mounting of shield tiles;

[0020] FIG. 6 shows a schematic view of a portion of the shield for a deposition apparatus according to embodiments of the present disclosure; [0021] FIG. 7 shows a schematic view of a part of a deposition apparatus according to embodiments of the present disclosure and includes a shield, for example an idle shield, according to embodiments of the present disclosure;

[0022] FIG. 8 shows a perspective view of a shield of a deposition apparatus according to embodiments described herein;

[0023] FIG. 9A and FIG. 9B show schematic views of a shield for a deposition apparatus according to embodiments described herein;

[0024] FIG. 10 shows a schematic view of a deposition apparatus with a deposition apparatus according to embodiments described herein;

[0025] FIG. 11 shows a schematic sectional view of a deposition system according to embodiments described herein; and

[0026] FIG. 12 is a flow diagram illustrating a method of operating a deposition system according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0027] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. In the following, the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0028] FIG. 1A is a schematic view of a deposition system 100 according to embodiments described herein. The deposition system 100 includes a deposition source, such as a vapor source 120 having one or more vapor outlets 125. The vapor source 120 is in a deposition position (II) for coating a substrate 10. In the deposition position, the one or more vapor outlets are directed toward a deposition area in which the substrate 10 is arranged.

[0029] FIG. IB is a schematic view of the deposition system 100 of FIG. 1A, wherein the vapor source 120 is in an idle position (I). In the idle position, the one or more vapor outlets 125 are directed toward a shield 110.

[0030] The vapor source 120 may be movable from the deposition position (II) into the idle position (I) in which the one or more vapor outlets 125 are directed toward the shield 110 and/or from the idle position (I) into the deposition position (II) in which the one or more vapor outlets 125 are directed toward the deposition area. For example, the deposition source, such as vapor source 120, can be moved by an angle. The deposition source may be rotated around the axis A.

[0031] The deposition source or vapor source 120 may be configured as an evaporation source for depositing an evaporated material on the substrate 10 that is arranged in a deposition area. In some embodiments, the vapor source 120 includes one or more crucibles and one or more distribution pipes, wherein one or more vapor outlets 125 may be provided in each of the one or more distribution pipes. Each crucible may be in fluid connection with an associated distribution pipe. Evaporated material may stream from the crucible into the associated distribution pipe. Plumes of evaporated material may be directed from the one or more vapor outlets of the distribution pipe into the deposition area, when the deposition system is in the deposition position.

[0032] In FIG. 1 A, evaporated material is directed from the one or more vapor outlets 125 toward the substrate 10. A material pattern may be formed on the substrate. In some embodiments, a mask (not shown) is arranged in front of the substrate 10 during deposition, i.e. between the substrate 10 and the vapor source 120. A material pattern corresponding to an opening pattern of the mask can be deposited on the substrate. In some embodiments, the evaporated material is an organic material. The mask may be a fine metal mask (FMM) or another type of mask, e.g. an edge exclusion mask.

[0033] After or before deposition on the substrate 10, the vapor source 120 may be moved into the idle position (I) that is exemplarily depicted in FIG. IB. The movement of the vapor source 120 into the idle position (I) may be a relative movement between the vapor source 120 and the shield 110. In the idle position, the one or more vapor outlets are directed toward a surface of the shield 110.

[0034] In some embodiments, the vapor source 120 is not deactivated in the idle position and/or during the movement into the idle position. Therefore, evaporated material may be directed from the one or more vapor outlets 125 toward the shield 110 and condense on a surface of the shield, when the vapor source is in the idle position (I). By continuing with the evaporation also in the idle position, e.g. during idle times of the system, a vapor pressure in the vapor source may be kept essentially constant and the deposition may continue later without a stabilization time of the vapor source.

[0035] The shield 110 may be formed such that 80% or more, particularly 90% or more, more particularly 99% or more of the evaporated material from the one or more vapor outlets 125 is directed toward a surface of the shield 110, when the vapor source 120 is in the idle position (I). A contamination of other surfaces in the vacuum processing chamber can be reduced or avoided, when the vapor source 120 is in the idle position, because the evaporation plumes may be blocked and shielded by the shield 110. In particular, a coating of the chamber walls, of devices arranged in the vacuum processing chamber, of mask carriers and of substrate carriers, can be reduced or avoided. In some embodiments, a surface of the shield 110 may be large, e.g. 0.5 m ² or more, particularly 1 m ² or more, more particularly 2 m ² or more, in order to make sure that most of the evaporated material condenses on the surface of the shield and not on another surface in the idle position.

[0036] The vapor source 120 may be moved into the idle position (I) for at least one or more of the following purposes: (i) for heating up the vapor source; (ii) for stabilizing the vapor source, e.g. during heat-up, until an essentially constant vapor pressure forms in the vapor source; (iii) for service or maintenance of the vapor source; (iv) for shut-down of the vapor source, e.g. during cool-down; (v) for cleaning of the vapor source, e.g. for cleaning of the one or more vapor outlets and/or for cleaning of shaper shields arranged in front of the vapor outlets; (vi) during mask and/or substrate alignment; (vii) during waiting times and in idle periods. For example, the idle position may be used as a park position of the deposition system in idle periods of the system. In some embodiments, the vacuum processing chamber and/or a mask which may be arranged in the deposition area may be protected against sprinkle coating by the shield 110, e.g. during the movement of the source into the idle position.

[0037] According to some embodiments, the deposition source or vapor source may move from the substrate 10 past the idle position (I) towards the further substrate as shown in more detail in Fig. 10 and Figs. 11. Accordingly, the idle position may alternatively be used for preventing sprinkle coating during a movement, i.e. a rotation, of the deposition source, for example, the vapor source 120.

[0038] According to embodiments described herein, a cooling device 112 for cooling of the shield 110 is provided. The shielding effect of the shield can be improved by reducing the temperature of the shield with the cooling device. Further, the heat radiation from the shield toward the vapor source, toward the mask and/or toward the substrate can be reduced by cooling the shield 110. Thermally caused movements can be reduced or avoided and the deposition quality may improve.

[0039] The evaporated material may have a temperature of hundreds of degrees, e.g. 100°C or more, 300°C or more, or 500°C or more. As compared to evaporation of organic materials, the heat load may particularly be high for evaporation of metallic materials.

[0040] The shield 110 may heat up in the idle position, when evaporated material condenses on a surface of the shield. In some embodiments, the vapor source 120 may remain in the idle position over a considerable period of time, e.g. over tens of seconds for alignment or cleaning, or over minutes for heat-up and service of the vapor source. A temperature of the shield 110 can be reduced by the cooling device 112, and a heat radiation from the shield toward the vapor source and toward the mask can be reduced. For example, the temperature of the shield may be kept at 100°C or less. The deposition quality can be improved, since a thermal movement of the mask is reduced. It is to be noted that, in some embodiments, the mask may have structures in the range of a few microns so that a constant temperature of the mask is beneficial for reducing thermally caused movements of the mask structures. Further, by cooling a surface of the shield 110, a condensation of evaporated material on the shield can be facilitated.

[0041] The cooling device may include at least one or more of: cooling conduits, cooling lines or cooling channels connected to the shield; a fluid cooling such as a water cooling; a gas cooling such as an air cooling and/or a thermoelectric cooling. In some embodiments, the cooling device includes a cooling circuit with cooling conduits in a frame of the shield and/or cooling conduits in the plate assembly of the shield. A cooling fluid such as water may circulate in the cooling circuit.

[0042] In some embodiments, cooling conduits may be provided at a center shield portion 115 of the shield. The one or more vapor outlets 125 may be directed toward the center shield portion 115 in the idle position so that the center shield portion 115 may be subject to most of the heat load in the idle position. The shield 110 may further include one or more side shield portions 116 arranged adjacent to the center shield portion 115. The one or more side shield portions 116 may be provided for shielding evaporated material during the movement of the vapor source into the idle position or past the idle position. The mask may be protected against sprinkle coating during the movement of the vapor source, as the one or more side shield portions 116 may block the evaporated material during the movement of the vapor source. In some embodiments, two side shield portions 116 are provided on two opposite sides of the center shield portion 115. The side shield portions 116 may be curved.

[0043] In some embodiments, which may be combined with other embodiments described herein, the deposition system 100 may include a first drive configured for moving the vapor source 120 together with the shield 110 along a source transportation path P (see FIG. 11). For example, the source transportation path may extend past the deposition area in which the substrate 10 is arranged. The vapor source 120 may be moved together with the shield 110 past the substrate 10, e.g. at an essentially constant speed. For example, the shield 110 and the vapor source 120 may be arranged on a source support, e.g. on a source cart, which is configured to be guided along a track. In some embodiments, the first drive may be configured for moving the source support along tracks along the source transportation path P, wherein the vapor source and the shield may be supported by the source support, i.e. the source cart. In some embodiments, the source support may be transported along the tracks without contacting the tracks, e.g. via a magnetic levitation system. In particular, the first drive may be configured for linearly moving the vapor source together with the shield along tracks which extend along the source transportation path P, i.e. a translational movement. [0044] When the shield 110 is movable together with the vapor source 120 along the source transportation path P, a distance between the vapor source and the shield may be kept small or constant during the deposition process. For example, a maximum distance between the vapor source and the shield during the deposition may be 0.5 m or less, particularly 0.2 m or less.

[0045] In some embodiments, which may be combined with other embodiments described herein, the deposition system may further include a second drive for moving the vapor source 120 relative to the shield 110 to the idle position (I). In other words, the first drive may be configured for moving the vapor source together with the shield, and the second drive may be configured for moving the vapor source relative to the shield. In the embodiment of FIG. 1A and FIG. IB, the vapor source 120 is rotatable relative to the shield 110 from the deposition position into the idle position around a rotation axis A. For example, the vapor source may be rotated from the deposition position into the idle position by an angle of 45° or more and 135° or less, particularly about 90°. Further, the deposition source such as the vapor source may be rotated from first deposition position into a second deposition position by an angle of 170° or more and 190° or less, particularly about 180°. For example, the vapor source may be movable from the idle position to the deposition position by rotating the vapor source, e.g. by rotating the vapor source back toward the deposition area, e.g. by an angle of about 90°, or by rotating the vapor source toward a second deposition area where a second substrate may be arranged, e.g. by an angle of about 90°.

[0046] A rotation of the vapor source may include any type of swinging or pivoting movement of the vapor source which leads to a direction change of the evaporation direction of the one or more vapor outlets. In particular, the rotation axis may intersect the vapor source, may intersect a periphery of the vapor source, or may not intersect the vapor source at all.

[0047] The rotation axis A may be an essentially vertical rotation axis. The vapor source

120 may be rotatable around the essentially vertical rotation axis between the idle position and the deposition position. In particular, the vapor source 120 may include one, two or more distribution pipes which may extend in an essentially vertical direction, respectively. A plurality of vapor outlets may be provided along the length of each distribution pipe, i.e. along the essentially vertical direction. A compact and space-saving deposition system can be provided. According to some embodiments, the rotation axis may be vertical. Further, additionally or alternatively, the one or more distribution pipes may extend in an essentially vertical direction, i.e. a direction being vertical or deviating from a vertical orientation by an angle of 15° or below, for example, 7° or below.

[0048] In some embodiments, which may be combined with other embodiments described herein, a radially inner surface of the shield 110 may be directed toward the vapor source. In particular, the shield 110 may include a curved portion which extends partially around the vapor source. For example, the shield may include two side shield portions 116 which may be curved and which may extend partially around the vapor source. In some embodiments, the portions of the shield may extend partially around the rotation axis A of the vapor source.

[0049] Due to the curvature of the vapor shield, the shielding effect of the shield may be improved during the rotation of the shield 110 around the rotation axis A. In particular, a distance between the one or more vapor outlets and the surface of the shield may remain substantially constant during a rotation of the shield.

[0050] In some embodiments, at least a portion of the shield is shaped as a part of a cylinder surface which extends around the vapor source, particularly around the rotation axis A of the vapor source.

[0051] In some embodiments, the curved portion of the shield 110 may extend around the vapor source 120 by an angle of 60° or more, particularly 90° or more. Accordingly, when the vapor source rotates by an angle of 60° or more, particularly 90° or more, from the deposition position to the idle position, the evaporated material may be essentially continuously shielded by the shield. A contamination of the vacuum processing chamber can be reduced and a heat radiation into the vacuum processing chamber can be decreased.

[0052] In some embodiments, which may be combined with other embodiments described herein, a distance D1 between the one or more vapor outlets and the shield may be 5 cm or more and 30 cm or less, when the vapor source is in the idle position. In particular, the distance D1 may be 5 cm or more and 10 cm or less. The shielding effect of the shield 110 can be further improved by providing a small distance between the shield and the one or more vapor outlets. Further, a more compact cooling device can be used, because most of the heat load of the vapor source is localized in a small portion of the shield in the idle position.

[0053] FIG. 2 is a perspective view of a shield 110 of a deposition system according to embodiments described herein. The shield 110 may be similar to the shield of the embodiment of FIG. 1A, so that reference can be made to the above explanations, which are not repeated here. Embodiments described with reference to other figures may equally be applicable to the details described with respect to FIG. 2, forming a yet further embodiment.

[0054] The shield 110 may be arranged adjacent to a vapor source such that the one or more vapor outlets of the vapor source are directed toward a surface of the shield when the vapor source is in the idle position. A cooling device 112 may be provided for cooling at least a portion of the shield. For example, a center shield portion 115 of the shield or shield assembly may be cooled with the cooling device 112. The center shield portion 115 can be understood as a portion of the shield which the one or more vapor outlets are directed to when the vapor source is in the idle position. In some embodiments, the center shield portion 115 is a center portion of the shield 110 or the shield assembly, respectively.

[0055] The shield 110 may be curved and may extend partially around an area where the vapor source is to be arranged. In particular, the shield may include one or more curved portions. For example, a shield assembly of the shield may include the center shield portion 115 and two side shield portions 116 which are arranged adjacent to the center shield portion 115 on two opposite sides of the center shield portion 115. The two side shield portions 116 may be curved around the area where the vapor source is to be arranged.

[0056] In some embodiments, which may be combined with other embodiments described herein, the shield assembly may include a plurality of shielding portions formed as sheet elements, e.g. as metal sheets or tiles. For example, a shield or shield assembly can be coupled to a frame. The shield or shield assembly can include a first side shield portion, a second side shield portion, and a center shield portion between the first side shield portion and the second side shield portion. [0057] For example, the shield may include one or more of: a bottom shield portion 119 which extends in an essentially horizontal orientation at a position below the one or more vapor outlets; a top shield portion 118 which extends in an essentially horizontal orientation at a position above the one or more vapor outlets; the center shield portion 115 which may extend in an essentially vertical orientation in front of the one or more vapor outlets, when the vapor source is in the idle position; and a first side shield portion and a second side shield portion. The two side shield portions which may extend in an essentially vertical orientation on two opposite sides of the center shield portion 115.

[0058] In some embodiments, the shield 110 may include a frame 111. The sheet portions of the shield 110 may be fixed to the frame 111. In particular, the frame 111 may be configured for holding and supporting at least one or more of the center shield portion and/or the side shield portions. The frame 111 may be supported on a source support which is configured for supporting and transporting the vapor source together with the shield. At least a part of the cooling conduits 113 may extend along the frame 111 of the shield 110. For example, the cooling conduits 113 may be fixed to or integrated in the support frame 111.

[0059] The sheet portions or tiles of the shield may be configured as consumables. In other words, one or more of the tiles or shield portions may be detachably mounted at the shield, particularly detachably mounted to an adjacent sheet portion and/or to the support frame 111 of the shield. It may be beneficial to periodically exchange and/or clean one or more of the sheet portions or tiles, e.g. when a layer of coating material has formed on a surface of a sheet portion. For example, in some embodiments, the center shield portion 115 may be detachably fixed to the support frame 111 such that the center shield portion can be demounted from the shield for cleaning. Similarly, the side shield portions may be disconnected from the shield for cleaning and/or exchange. Accordingly, a quick exchange of separate sections or portions of the shield may be possible, e.g. without disconnecting the support frame 111 from the source support. Downtimes of the system can be reduced.

[0060] The cooling device 112 may include one or more cooling lines or cooling conduits 113 for a cooling fluid for cooling the center shield portion 115 and/or for cooling other sheet portions of the shield. [0061 ] In some embodiments, a height of the shield 110 is 1 m or more, particularly 2 m or more. In particular, the height of the shield 110 may be larger than a height of the vapor source 120 so that the evaporated material from the vapor source can be shielded by the shield in the idle position. The vapor source 120 may have a height of 1 m or more, particularly 1.5 m or more.

[0062] In some embodiments, which may be combined with other embodiments described herein, a width W of the shield may be 50 cm or more, particularly 1 m or more. The width W may be a maximum dimension of the shield 110 in a horizontal direction, e.g. in a direction perpendicular to the orientation of the substrate 10 during deposition, as is depicted in FIG. 1A and FIG. IB. In some embodiments, which may be combined with other embodiments described herein, an average radius of curvature of the shield may be 60 cm or more.

[0063] FIG. 3 is a schematic sectional view of a part of a deposition system according to embodiments described herein. A vapor source 120 is shown in the idle position in which the evaporated material 15 is directed toward the shield 110, particularly toward the center shield portion 115 of the shield. The center shield portion 115 may be cooled by a cooling device such that the temperature of the shield can be kept low and a heat radiation into the deposition area can be reduced.

[0064] As is schematically depicted in FIG. 3, two side shield portions 116 may be arranged next to the center shield portion 115 on both sides of the center shield portion 115. The side shield portions may shield the evaporated material 15 during a movement of the vapor source 120 into and from the idle position. In particular, the vapor source may be rotated into the idle position around a rotation axis, and the shield may extend around the rotation axis in a curved way. Cooling conduits may be provided at a support frame of the shield. By providing the cooling conduits at the support frame, the sheet portions can be exchanged without exchange of the cooling conduits. The center shield portion 115 may be fixed to a portion of the support frame 111 that includes a portion of the cooling conduits 113.

[0065] Fig. 2 shows a shield 110 having a shield assembly with tiles 410. The tiles 410 may, for example, form the center shield portion 115. As shown in Fig. 2, the tiles may be elongated, e.g. in a vertical direction. For example, according to some embodiments, which can be combined with other embodiments described herein, an aspect ratio of a width and a height of a tile may be 1 :5 or below. The tile may extend along the height of the shield or the vapor source 120, respectively. Having an elongated tile allows for exchanging a portion of the shield assembly in a few pieces. For example, the center shield portion may include two or more, for example, three or more tiles, forming the center shield portion. However, due to the weight of the tiles, exchange of elongated tiles may be difficult.

[0066] According to some embodiments, which can be combined with other embodiments described herein, smaller tiles may be utilized. Accordingly, easier exchange of tiles for maintenance can be provided. According to some embodiments, which can be combined with other embodiments described herein, and aspect ratio of a width and a height of the tile can be from 1 :4 to 4: 1.

[0067] FIG. 4A shows a shield 110. The shield 110 includes frame 111. The shield includes the shield assembly coupled to the frame. The shield assembly can include the first side shield portion 116, a second side shield portion (not shown in FIG. 4A), and a center shield portion 115. The portions of the shield assembly, and particularly the center shield portion can include a plurality of tiles 410. Fig. 4A further shows a top shield portion 118 and hinges 420 discussed in more detail with respect to FIG. 5. The rear side of the shield may further include a plate assembly having plates 550. For example, a plurality of plates can be provided, which may optionally correspond to the plurality of shields in the shield assembly.

[0068] An enlarged view of a tile 410 is shown in Fig. 4B. According to some embodiments, a tile for a shield can include a tile body. The tile can be configured to shield material of a deposition source in a vacuum processing chamber. The tile body includes the first side, for example, a side shown in Fig. 4B. The first side has a structured surface. Accordingly, accumulation of material from the deposition source can be improved and flaking off of material from the tile can be reduced.

[0069] According to some embodiments, which can be combined with other embodiments described herein, the structured surface can include a macro-structure 412. For example, the macro-structure can include the milled structure such as a diamond shaped structure as shown in Fig. 4B. Additionally or alternatively, the structured surface may include a micro-structure. The microstructure may be a blasted structure or a blasted surface. For example, the structured surface having the micro-structure can be sandblasted or plastered with other particles. A micro-structure can be formed on the micro-structure. Providing a macro-structure and micro-structure can further improve material adherence to the tile. The time between maintenance cycles can be increased and, thus, the uptime of a deposition apparatus can be improved. As described herein, a macro-structure may include a structure having a pattern with pattern structures of the size of 2 mm or above and/or a pitch of the pattern structure of 4 mm or above. A micro-structure may include a structure having a pattern with a pattern structure of a size of 1 mm or below.

[0070] According to one embodiment, a tile for a shield shielding material of a deposition source in a vacuum processing chamber is provided. The tile includes a tile body. The tile body has a first side of the tile body configured to face the deposition source and a second side of the tile body opposite the first side. The second side includes at least one recess for mounting the tile to the shield. The first side has a structured surface.

[0071] According to some embodiments, which can be combined with other embodiments, one or more tiles can be provided next to each other to form the shield assembly or a portion of the shield assembly, such as the center shield portion. The first side has the structured surface as an edge or edges, respectively, i.e. perimeter edges. For example, the perimeter can have a rectangular shape or another polygon shape. An edge can form the border between the first side and side surfaces of the tile. For example, for a rectangular tile, there may be a first side surface, a second side surface, a third side surface, and a fourth side surface. The side surface combines the first side and the second side opposing the first side. The one or more edges of the first side may, according to some embodiments which can be combined with other embodiments described herein, be rounded. For example, an edge may have a radius of 0.5 mm or above, particularly 1 mm or above. The rounded edge reduces flaking off of material collected at the first side of the tile, i.e. the tile having the structured surface.

[0072] Further aspects, details, modifications and embodiments of a tile and a shield are now described with respect to FIGS. 5A and 5B. FIG. 5A shows a tile 410. The tile has a first side 512 and a second side 514 opposing the first side. The first side is configured to face the deposition source during operation of a deposition apparatus. The second side is configured to mount the tile to the shield.

[0073] According to some embodiments, which can be combined with other embodiments, the one or more tiles of a shield assembly can be mounted to a frame, for example, the frame 411 shown in FIG. 4A. Additionally or alternative, the tiles can be mounted to plates 550 of a plate assembly. The plates (or the frame correspondingly) may include openings 552. The openings may have a keyhole shape. A screw 562 and a pin 564 may be connected to reach at least partially through the opening 552. The keyhole shape of the opening allows for assembling the screw and the pin from one side. The pin can be inserted through the larger portion of the keyhole shape opening and can be moved to clamp the pin in the keyhole. The tile 410 can have one or more recesses at the second side 514 of the tile 410. The one or more recesses can be keyhole slots. A tile can be mounted to a plate 550 by inserting the one or more pins in the one or more keyhole slots of the tile. Torque can be applied to the one or more screws to fasten the tile 410 to the plate 550. Particularly, four or more screws can be utilized to improve the connection of the tile to the water-cooled components. Accordingly, good thermal contact can be provided. Accordingly, the tile temperature can be provided to be below a certain predetermined temperature to improve material growth without peeling, for example, growth of organic material. A similar fixation can be provided if a tile is additionally or alternatively mounted to the frame.

[0074] According to some embodiments, which can be combined with other embodiments described herein, tiles of the plurality of tiles included in a shield assembly can be coupled to corresponding plates of the plate assembly. The at least one recess of the second side of a tile can be a keyhole slot. For example, the at least one recess are one or more patterns of keyhole slots 522, such as a rectangle as shown in FIG. 5B. As further optional modifications, at least 4 keyholes slots are provided corresponding to comers of the tile and/ or a distance of two neighboring keyhole slots is 10 cm or less.

[0075] Fig. 6 shows a further aspect of embodiments of tiles, that may be combined with other embodiments described herein. The tiles shown in FIG. 6 may have at least one of a protrusion 622 and a recess 624 at an end of the tile. For example, a tile may have a protrusion at one end and a recess at an opposing end. Accordingly, an overlap between neighboring tiles can be provided. The overlap may reduce deposition material to accidentally pass through a gap between neighboring tiles. According to one embodiment, which can be combined with other embodiments described herein, a tile may include side surfaces of the tile body including a first side surface, a second side surface, a third side surface and a fourth side surface, the side surfaces connecting the first side of the tile body and the second side of the tile body, wherein at least two side surfaces comprise at least one of a recess and a protrusion configured for overlapping of the tile with a neighboring tile.

[0076] FIG. 7 shows a portion of a deposition apparatus. One side of a vacuum chamber 702 is shown. A first substrate transport 712 for transporting a substrate in a deposition area is shown. A second substrate may be provided for transporting a second substrate in a further deposition area in the vacuum chamber. A guide 722 for a source cart is provided in the deposition apparatus. The deposition source can be moved along the guide, e.g. with a first drive. For example, the deposition source can be moved from left to right and vice versa in FIG. 7. The deposition source can be moved together with a shield 110.

[0077] According to one embodiment, a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber, is provided. The shield includes a frame 411 configured to be mounted to the deposition apparatus. For example, the frame 411 can be mounted to a vacuum chamber 702 of the deposition apparatus. A shield assembly is coupled to the frame. The shield assembly includes a first side shield portion 116 and a second side shield portion 116. The shield further includes a center shield portion between the first side shield portion and the second side shield portion, the shield assembly being configured to be arranged between a wall 705 of the vacuum chamber 702 and the deposition source to shield deposition material in a closed position of the shield assembly. The shield further includes a door arrangement configured to move at least a portion of the shield assembly to allow access to the deposition source in an open position of the shield assembly.

[0078] In FIG. 7, the center shield portion includes a first side 715A and a second side 715B. The center shield portion can be opened as a hinged door, for example, utilizing hinges shown in FIG. 4A. The door arrangement can include hinges coupled to the center shield portion to move a first side of the center shield portion by an angle and to move a second side of the center shield portion by an angle. [0079] Reverting back to FIG. 6, an overlap and a recess may also be provided for neighboring tiles when the door arrangement is in the closed position. For example, a recess can be provided at the first side 715A and a protrusion can be provided at the second side 715B . Further, a protrusion can be provided at the first side 715 A and a recess can be provided at the second side 715B.

[0080] FIG. 8 illustrates a yet further embodiment of a door arrangement. A door arrangement can also be provided by supporting a portion of the shield 110 or the shield assembly on a guiding rail. Accordingly, the shield or a portion of the shield can be moved by a sliding movement along the guiding rail. Accordingly, additionally or alternatively to a hinged door operation, also a sliding door operation can be provided. By sliding and moving at least a portion of the shield, access to the deposition source can be provided for maintenance or the like. According to some embodiments, which can be combined with other embodiments described herein, a door arrangement may include a guiding rail for sliding at least the center portion of the shield assembly to allow access to the deposition source.

[0081] FIGS. 9A and 9B illustrate yet further aspects of embodiments that may be combined with other embodiments described herein. FIG. 9A shows a shield 110. The shield may include a frame 411 having, for example, several frame tubes. Side shield portions 116 of the shield assembly may be supported by the frame. Further, tiles 410 can be coupled to the frame or to a plate assembly supported by the frame. Cooling channels or cooling conduits 113 can be provided. The cooling channels may extend into the frame 411. Tiles coupled to the frame 411 are cooled by contact with the frame. For example, tiles 910 in the center of the center shield portion can be cooled. Cooling the center may be beneficial as the idle position can beneficially be provided in the center. Accordingly, the center tiles may experience the most heat load.

[0082] As explained above, the tiles may be elongated, e.g. along the height of the shield assembly. Heating of two three or four tiles in the center may further be provided for organic evaporation, wherein the heat load may be smaller as compared to metallic evaporation. Accordingly, the shield shown in FIG. 9 A may be utilized for an organic deposition source or vapor source and/or a deposition apparatus for organic material deposition. A hinge of a door arrangement as illustrated in FIG. 9B may also be provided for FIG. 9A. [0083] For metallic deposition, the cooling zone, for example, at the center shield portion may be increased. This is exemp lardy shown in FIG. 9B. The shield 110 includes the frame 411. A plate assembly having cooling channels is attached to the frame 411. A plurality of tiles can be mounted to the plate assembly, e.g. next to each other or also vertically arranged. Cooling channels 913 can be attached to or embedded in plates of the plate assembly. The center shield portion 115 between the side shield portions 116 can be cooled. The increased heating area as well as the cooling conduits in the plates, i.e. over an enlarged area can improve cooling of the shield assembly. Accordingly, higher heat loads may be handled by a shield as described with respect to FIG. 9B.

[0084] According to some embodiments, which can be combined with other embodiments described herein, a cooling unit for cooling of at least the center shield portion of the shield assembly or portion of the center shield portion can be provided. The cooling unit includes at least one of cooling conduits in the frame and cooling conduits in a plate assembly of the shield assembly. Tiles of the plurality of tiles can be coupled to corresponding plates of the plate assembly. Tiles can be cooled by contact to the frame portion and/or by contact to the plate assembly.

[0085] FIG. 10 is a schematic view of a deposition apparatus 1000 according to embodiments described herein. The deposition apparatus can be configured for depositing material on substrates subsequently in a vacuum chamber, such as the vacuum processing chamber 101. According to an embodiment, a deposition apparatus for processing substrates subsequently in a vacuum chamber is provided. The apparatus includes a first substrate processing position adjacent a first side wall of the vacuum chamber and a second substrate processing position adjacent a second side wall of the vacuum chamber, the second side wall being opposite the first side wall. A deposition source is provided between the first substrate processing position and the second substrate processing position. The apparatus further includes a source cart configured to translate the deposition source between the first substrate processing position and the second substrate processing position and an actuator configured to rotate the deposition source between a first direction depositing material on a substrate at the first substrate processing position and a second direction depositing material on a substrate at the second substrate processing position. The deposition apparatus further includes a shield according to any of the embodiments of the present disclosure. [0086] According to some embodiments, the shield can be mounted on the source cart. Further, additionally or alternatively, the door arrangement of the shield faces a third side wall 1013 of the vacuum chamber connecting the first side wall and the second side wall. For example, the third side wall is arranged to provide maintenance access to the shield in the closed position of the door arrangement and to provide maintenance access to the deposition source in the open position of the door arrangement.

[0087] FIG. 10 shows the deposition apparatus 1000. The deposition apparatus includes a vacuum processing chamber 101 with at least one deposition area for arranging a substrate. A sub-atmospheric pressure may be provided in the vacuum processing chamber, e.g. a pressure of lO mbar or less. A deposition system 100 according to embodiments described herein is arranged in the vacuum processing chamber 101.

[0088] In the exemplary embodiment of FIG. 10, two deposition areas are provided in the vacuum processing chamber 101, namely a first deposition area 103 for arranging a substrate 10 to be coated and a second deposition area 104 for arranging a second substrate 20 to be coated. Further, a deposition system 100 according to any of the embodiments described herein is arranged in the vacuum processing chamber 101. The first deposition area 103 and the second deposition area 104 may be provided on opposite sides of the deposition system 100.

[0089] In some embodiments, the deposition system 100 includes a vapor source 120 with one or more distribution pipes having one or more vapor outlets for directing plumes of evaporated material toward the substrate. Further, the deposition system 100 includes a shield 110 and a cooling device 112 for cooling the shield 110. The vapor source 120 can be moved from a deposition position that is shown in FIG. 10 into an idle position in which the one or more vapor outlets are directed toward the shield 110. In the deposition position, the one or more vapor outlets are directed to the first deposition area or to the second deposition area.

[0090] In some embodiments, which may be combined with other embodiments described herein, the vapor source 120 is movable past the first deposition area 103, is rotatable between the first deposition area 103 and the second deposition area 104, and movable past the second deposition area 104. The idle position may be an intermediate rotation position of the vapor source 120 between the first deposition area 103 and the second deposition area 104. In particular, the vapor source may be rotated by about 90°, e.g. clockwise, from the (first) deposition position depicted in FIG. 10 into the idle position. The vapor source may be rotated by about 90° in the same direction, e.g. clockwise, from the idle position into a second deposition position for directing evaporated material toward the second deposition area 104 where the second substrate 20 may be arranged. Alternatively, the vapor source may be rotated back, e.g. counterclockwise, from the second deposition area 104 to the idle position and/or from the idle position to the (first) deposition position.

[0091] The vapor source 120 may be movable along a source transportation path P, which may be a linear path. In particular, a first drive may be provided for moving the vapor source 120 together with the shield 110 along the source transportation path P past the first deposition area 103 and/or past the second deposition area 104.

[0092] In some embodiments, the shield 110 and the vapor source 120 may be supported on a source support 128, e.g. on a source cart, that is movable along a source track 131 in the vacuum processing chamber 101. An example of a source support 128 that carries the vapor source 120 and the shield 110 is depicted in FIG. 11. The source support 128 may be driven contactlessly along the source tracks 131, e.g. via a magnetic levitation system.

[0093] As is depicted in the sectional view of FIG. 11 in more detail, the vapor source 120 may include one, two or more distribution pipes 122 which may extend in an essentially vertical direction. Each distribution pipe of the one, two or more distribution pipes 122 may be in fluid connection with a crucible 126 configured for evaporating a material. Further, each distribution pipe of the one, two or more distribution pipes may include a plurality of vapor outlets 125, e.g. nozzles, arranged along the length of the one, two or more distribution pipes 122. For example, ten, twenty or more vapor outlets may be provided along the length of the distribution pipe, e.g. in an essentially vertical direction. The shield 110 may extend at least partially around the one, two or more distribution pipes of the vapor source. For example, the shield may surround the one, two or more distribution pipes 122 by an angle of 45° or more, particularly 60° or more, more particularly 90° or more. In some embodiments, an opening angle of the plumes of evaporated material propagating from the vapor outlets in a horizontal sectional plane may be between 30° and 60°, particularly about 45°. [0094] FIG. 11 shows a deposition system in the idle position in which the plurality of vapor outlets 125 are directed toward the shield 110. A surface of the shield 110 may be cooled with a cooling device 112. Heat radiation toward the vapor source 120 and toward the deposition area may be reduced.

[0095] As is depicted in more detail in FIG. 10, the deposition apparatus 1000 may be configured for the subsequent coating of the substrate 10 arranged in the first deposition area 103 and the second substrate 20 arranged in the second deposition area 104. When the vapor source 120 moves between the deposition areas, the vapor source 120 may stop in the idle position in which the one or more vapor outlets are directed toward the cooled shield. For example, the vapor source 120 may stop for at least one of: service, maintenance, cleaning, waiting, aligning of the substrate or the mask. Alternatively, the vapor source moves continuously between the deposition areas, without stopping in the idle position.

[0096] The deposition apparatus 1000 may be configured for masked deposition on one or more substrates. A mask 11 may be arranged in the first deposition area 103 in front of the substrate 10, and/or a second mask 21 may be arranged in the second deposition area 104 in front of the second substrate 20.

[0097] In some embodiments, which may be combined with other embodiments described herein, a shielding arrangement 12 may be arranged at a periphery of the mask 11, e.g. adjacent to two opposite sides of the mask 11 in the direction of the source transportation path P, as is depicted in FIG. 10. In some embodiments, the shielding arrangement 12 may surround the mask 11 in a frame-like manner. The shielding arrangement may include a plurality of shielding units which may be attached to a mask carrier that holds the mask 11. For example, the shielding arrangement 12 may be detachably attached at a periphery of the mask such as to be easily and quickly exchangeable, e.g. for cleaning.

[0098] The shielding arrangement 12 may be configured for shielding evaporated material which is directed from the one or more vapor outlets toward a periphery of the mask 11. A coating of the mask carrier and/or of a wall of the vacuum processing chamber 101 can be reduced or avoided. For example, after the deposition on the substrate 10, the evaporated material may be directed toward the shielding arrangement 12 which may extend essentially parallel to the substrate 10 and which may be arranged adjacent to the mask 11 along the source transportation path P. In the deposition position depicted in FIG. 10, evaporated material is directed toward the shielding arrangement 12. Thereafter, the vapor source 120 may rotate toward the idle position, and the evaporated material may be directed toward the shield 110. Cleaning efforts can be reduced.

[0099] In some embodiments, the shielding arrangement 12 is arranged next to the mask

11 in the first deposition area 103, and a second shielding arrangement 22 is arranged next to the second mask 21 in the second deposition area 104. For example, the second shielding arrangement 22 is arranged at a periphery of the second mask 21 and configured for shielding evaporated material directed toward the periphery of the second mask 21. In particular, the shielding arrangement 12 may be arranged in the first deposition area 103 for shielding evaporated material directed to the periphery of the mask 11 in the first deposition area 103, and the second shielding arrangement 22 may be arranged in the second deposition area 104 for shielding evaporated material directed to the periphery of the second mask 21 in the second deposition area 104. During the movement of the vapor source between the deposition areas, the shield 110 may shield the evaporated material.

[00100] In some embodiments, a minimum distance between the shielding arrangement

12 and the shield 110 may be 10 cm or less, particularly 5 cm or less, more particularly 2 cm or less, and/or a minimum distance between the second shielding arrangement 22 and the shield 110 may be 10 cm or less, particularly 5 cm or less, more particularly 2 cm or less. Sprinkle coating past the shielding surfaces of the shield and of the shielding arrangement at a transition between the shield and the shielding arrangement can be reduced or avoided. In particular, the shield may extend over more than 50%, particularly over more than 80%, of a width of the vacuum processing chamber 101 between the mask 11 and the second mask 21.

[00101] In some embodiments, which may be combined with other embodiments described herein, a minimum distance between the vapor source 120 and the shield 110 during a movement of the vapor source from the deposition position to the idle position is 5 cm or less, particularly 1 cm or less. In other words, the vapor source 120 and the shield 110 may come close to each other during the rotation of the vapor source into the idle position. [0001] In some embodiments, which can be combined with other embodiments described herein, a distance between the one or more vapor outlets and the substrate during the deposition on the substrate may be 30 cm or less, particularly 20 cm or less, more particularly 15 cm or less. A small distance between the vapor outlets and the substrate leads to a small overrun of the evaporated material in an edge region of the mask 11 during deposition. Therefore, a more compact shielding arrangement can be provided, since an area of the evaporation plume which hits the mask and the substrate may be small. Further, the deposition quality may be increased.

[0002] According to a further aspect described herein, a method of operating a deposition system is described. The deposition system may be a deposition system according to any of the embodiments described herein. In particular, the deposition system includes a vapor source with one or more vapor outlets, wherein the vapor source is movable into an idle position.

[0003] FIG. 12 is a flow diagram which schematically illustrates a method of assembling a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber and/or method of accessing a deposition source of a deposition apparatus having a vacuum chamber. In operation 710, a recess of a tile is guided over a pin coupled to a screw. Further, the tile is fixed to a plate assembly or a frame by applying torque to the screw. One or more tiles can be fixed to the shield and may form a shield assembly having side shield portions and a center shield portion between the side shield portions. For example, the tiles can be mounted in an opening position of a door arrangement of the shield assembly.

[0004] The shield assembly is arranged between a wall of the vacuum chamber and the deposition source to shield deposition material in a closed position of the door arrangement. In operation 720, the door can be closed to keep material to be deposited on the wall during operation, e.g. when the source is positioned in the idle position or is moved past the idle position. In operation 730, the door can be opened to allow access to the deposition source and/or to tiles of the shield assembly for maintenance.

[0005] In light of the above, a plurality of embodiments are provided, which can be combined with other embodiments described herein. The embodiments are: [00107] Embodiment 1. A tile for a shield configured to shield material of a deposition source in a vacuum processing chamber, including: a tile body; a first side of the tile body configured to face the deposition source; and a second side of the tile body opposite the first side, the second side having at least one recess for mounting the tile to the shield, wherein the first side has a structured surface.

[00108] Embodiment 2. The tile according to embodiment 1, wherein the structured surface includes macro-structure and micro-structure.

[00109] Embodiment s. The tile according to embodiment 2, wherein the macro structure includes milled structures.

[00110] Embodiment 4. The tile according to embodiment 3, wherein the milled structures are diamond shaped.

[00111] Embodiment s. The tile according to embodiment 2, wherein the micro structure is a blasted structure.

[00112] Embodiment 6. The tile according to any of embodiments 1 to 5, wherein the first side has no openings and wherein the recess is closed towards the first side.

[00113] Embodiment 7. The tile according to any of embodiments 1 to 6, further including: side surfaces of the tile body including a first side surface, a second side surface, a third side surface and a fourth side surface, the side surfaces connecting the first side of the tile body and the second side of the tile body, wherein at least two side surfaces include at least one of a recess and a protrusion configured for overlapping of the tile with a neighboring tile.

[00114] Embodiment 8. The tile according to any of embodiments 1 to 7, wherein the at least one recess of the second side is a keyhole slot.

[00115] Embodiment 9. The tile of embodiment 8, wherein the at least one recess are one or more patterns of keyhole slots.

[00116] Embodiment 10. The tile of embodiment 9, wherein the one or more patterns are rectangles. [00117] Embodiment 11. The tile of any of embodiments 8 to 10, wherein at least 4 keyholes slots are provided corresponding to comers of the tile.

[00118] Embodiment 12. The tile of any of embodiments 8 to 10, wherein a distance of two neighboring keyhole slots is 18 cm or less.

[00119] Embodiment 13. The tile of any of embodiments 1 to 12, wherein an aspect ratio of a width and a height of the tile is from 1 :4 to 4: 1.

[00120] Embodiment 14. The tile of any of embodiments 1 to 12, wherein an aspect ratio of a width and a height of the tile is 1 :5 or below.

[00121] Embodiment 15. The tile of any of embodiments 1 to 14, wherein the first side has one or more edges with a radius of 0.5 mm or larger.

[00122] Embodiment 16. A shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber, including: a frame configured to be mounted to the deposition apparatus; a shield assembly coupled to the frame, including: a first side shield portion; a second side shield portion; and a center shield portion between the first side shield portion and the second side shield portion, the shield assembly being configured to be arranged between a wall of the vacuum chamber and the deposition source to shield deposition material in a closed position of the shield assembly; the shield further including: a door arrangement configured to move at least a portion of the shield assembly to allow access to the deposition source in an open position of the shield assembly.

[00123] Embodiment 17. The shield according to embodiment 16, wherein the door arrangement includes: hinges coupled to the center shield portion to move a first side of the center shield portion by an angle and to move a second side of the center shield portion by an angle.

[00124] Embodiment 18. The shield according to embodiment 17, wherein the first side of the center shield portion and the second side of the center shield portion are configured to be opened as a hinged door. [00125] Embodiment 19. The shield according to any of embodiments 16 to 18, wherein the door arrangement includes: a guiding rail for sliding at least the center shield portion of the shield assembly to allow access to the deposition source.

[00126] Embodiment 20. The shield according to any of embodiments 16 to 19, further including: a cooling unit for cooling of at least a portion of the center shield portion of the shield assembly, the cooling unit including: at least one of cooling conduits in the frame; and cooling conduits in a plate assembly of the shield assembly.

[00127] Embodiment 21. The shield according to any of embodiments 16 to 19, the shield assembly further including: a plurality of tiles according to any of embodiments 1 to 15.

[00128] Embodiment 22. The shield according to embodiment 20, the shield assembly further including: a plurality of tiles according to any of embodiments 1 to 15.

[00129] Embodiment 23. The shield according to any of embodiments 21 to 22, wherein the plurality of tiles are cooled by contact to the frame.

[00130] Embodiment 24. The shield according to embodiment 22, wherein tiles of the plurality of tiles are coupled to corresponding plates of the plate assembly.

[00131] Embodiment 25. The shield according to embodiments 24, wherein the plurality of tiles are cooled by contact to the plate assembly.

[00132] Embodiment 26. The shield according to any of embodiments 16 to 25, the shield assembly further including: a top shield portion provided at least partially above the first side shield portion, the second side shield portion and the center shield portion, wherein the top shield portion is orientated essentially horizontally.

[00133] Embodiment 27. A deposition apparatus for depositing substrates subsequently in a vacuum chamber, including: a first substrate processing position adjacent a first side wall of the vacuum chamber; a second substrate processing position adjacent a second side wall of the vacuum chamber, the second side wall being opposite the first side wall; a deposition source between the first substrate processing position and the second substrate processing position; a source cart configured to translate the deposition source between the first substrate processing position and the second substrate processing position; an actuator configured to rotate the deposition source between a first direction depositing material on a substrate at the first substrate processing position and a second direction depositing material on a substrate at the second substrate processing position; and a shield according to any of embodiments 16 to 26.

[00134] Embodiment 28. The deposition apparatus according to embodiment 27, wherein the shield is mounted on the source cart.

[00135] Embodiment 29. The deposition apparatus according to any of embodiments 17 to 28, wherein the door arrangement of the shield faces a third side wall of the vacuum chamber connecting the first side wall and the second side wall.

[00136] Embodiment 30. The deposition apparatus according to embodiment 29, wherein the third side wall is arranged to provide maintenance access to the shield in the closed position of the door arrangement and to provide maintenance access to the deposition source in the open position of the door arrangement.

[00137] Embodiment 31. A method of assembling a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber, including: guiding a recess of a tile over a pin coupled to a screw; and fixing the tile to a plate assembly or a frame by applying torque to the screw.

[00138] Embodiment 32. The method according to embodiment 31, wherein the tile is fixed with screws at 4 or more recesses for effective thermal conduction.

[00139] Embodiment 33. A method of accessing a deposition source of a deposition apparatus having a vacuum chamber, including: opening a door arrangement of a shield assembly arranged between a wall of the vacuum chamber and the deposition source to shield deposition material in a closed position of the door arrangement.

[0001] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.