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Patent Searching and Data


Title:
IGBT MODULE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2017/181840
Kind Code:
A1
Abstract:
The present invention relating to the field of electronic elements discloses an IGBT module assembly, comprising a cold plate and an IGBT module attached to the cold plate. The IGBT module is provided with wiring terminals on an end facing away from the cold plate, the IGBT module comprises a side face adjacent to the end face, and the side face and the cold plate are formed with water guiding grooves. The method of the present invention allows, by using the side face and the cold plate formed with water guiding grooves, a large amount of condensed water accumulated on the cold plate to be guided through the water guiding grooves to flow out, instead of causing the condensed water to flow to the end face of the IGBT module provided with the wiring terminals. thereby avoiding an interelectrode short circuit between the wiring terminals on the IGBT module, and preventing an electrical accident. Moreover, the IGBT module can operate safely and efficiently in a high-power cooling condition, thereby expanding the applications of the IGBT module.

Inventors:
WANG JING (CN)
JIANG SHIYONG (CN)
ZHANG YU (CN)
LIU KEQIN (CN)
Application Number:
PCT/CN2017/079246
Publication Date:
October 26, 2017
Filing Date:
April 01, 2017
Export Citation:
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Assignee:
GREE ELECTRIC APPLIANCES INC ZHUHAI (CN)
International Classes:
H01L23/367
Foreign References:
CN105390460A2016-03-09
CN105789156A2016-07-20
CN202282938U2012-06-20
US6408937B12002-06-25
Other References:
See also references of EP 3447796A4
Attorney, Agent or Firm:
KANGXIN PARTNERS, P.C. (CN)
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