IMAGE ACQUIRING METHOD AND IMAGE ACQUIRING APPARATUS USING SAME

WIPO Patent Application WO/2014/209043

A1

The present invention relates to an image acquiring method, which can more specifically image defects of a flat surface of a target to be measured such as a wafer, and an image acquiring apparatus using the same. An image acquiring method according to one embodiment of the present invention acquires an image by using a measurement apparatus including an image acquiring means which acquires an image of a surface of a target to be measured in the unit of predetermined size pixels and a movement means which can move the target to be measured. The method comprises the steps of: acquiring an image of a first region from the surface of the target to be measured, through the image acquiring means; acquiring an image of a second region, which is different from the first region, by moving the target to be measured, through the movement means; acquiring a differential image by subtracting, from either the image of the first region or the image of the second region, the other image; and overlapping the differential image multiple times.

JO AH JIN (KR)
LEE JU SUK (KR)
CHUNG SANG HAN (KR)
NOH HAN AUL (KR)

PCT/KR2014/005714

December 31, 2014

June 26, 2014

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PARK SYSTEMS CORP (KR)

G01Q30/00; G01N21/88; G06T5/50

JPH08146137A	1996-06-07
JPH0663984B2	1994-08-22
US6236057B1	2001-05-22
KR20100092014A	2010-08-19
JP2009115613A	2009-05-28
JP2010151697A	2010-07-08

See also references of EP 3015850A4
None

OH, SEIL (KR)
오세일 (KR)

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