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Patent Searching and Data


Title:
IMAGE CAPTURING MODULE AND ASSEMBLY METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/180378
Kind Code:
A2
Abstract:
Disclosed are an image capturing module and an assembly method therefor. The image capturing module comprises a photosensitive chip, an optical lens and a connecting device, the optical lens being arranged on a photosensitive path of the photosensitive chip, the connecting device comprising a circuit board and a bearing element. The photosensitive chip and the circuit board are respectively mounted on the bearing element, the photosensitive chip is electrically connected to the circuit board, and the photosensitive chip is not in direct contact with the circuit board. Therefore, heat produced by the photosensitive chip when undertaking a photoelectric conversion operation does not deform the circuit board and cause the photosensitive chip to tilt and affect the imaging quality of the image capturing module.

Inventors:
FANG FANG (CN)
LUO MENGJIE (CN)
ZHANG BAOZHONG (CN)
ZHAO BOJIE (CN)
WANG MINGZHU (CN)
LI JIANJUN (CN)
Application Number:
PCT/CN2016/089890
Publication Date:
November 17, 2016
Filing Date:
July 13, 2016
Export Citation:
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Assignee:
NINGBO SUNNY OPOTECH CO LTD (CN)
International Classes:
H04N5/225
Attorney, Agent or Firm:
NINGBO RAYMOND IP AGENCY FIRM (CN)
宁波理文知识产权代理事务所(特殊普通合伙) (CN)
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