Title:
IMAGE PICKUP APPARATUS, IMAGE PICKUP APPARATUS MANUFACTURING METHOD, AND ENDOSCOPE SYSTEM
Document Type and Number:
WIPO Patent Application WO/2014/188788
Kind Code:
A1
Abstract:
An image pickup apparatus (1) is provided with: a rectangular parallelepiped image pickup chip (10), which has a plurality of functional section patterns, including a light receiving section (11), formed on a first main surface (10SA), and which is formed of a semiconductor material; and a cover glass (30), which has alignment marks (31) formed at least at two areas having predetermined positional relationships with the functional section patterns, and which is formed of a transparent material bonded to cover the light receiving section (11) by having an adhesive layer therebetween.
Inventors:
FUJIMORI NORIYUKI (JP)
Application Number:
PCT/JP2014/059258
Publication Date:
November 27, 2014
Filing Date:
March 28, 2014
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/04; H04N5/225; G02B23/24; H01L27/14; H04N5/335
Foreign References:
| JPS5944006A | 1984-03-12 | |||
| JPH04235475A | 1992-08-24 | |||
| JP2008118568A | 2008-05-22 |
Other References:
See also references of EP 3001673A4
Attorney, Agent or Firm:
ITOH SUSUMU (JP)
Susumu Ito (JP)
Susumu Ito (JP)
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