Title:
IMAGE PICKUP DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING IMAGE PICKUP DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/158722
Kind Code:
A1
Abstract:
An image pickup device 1 is provided with: an image pickup element 10 having wiring 13 that connects a first electrode 12 of a light receiving surface 10SA and a second electrode 14 of a rear surface 10SB to each other; a first wiring board 30 wherein an end surface 30SS, from which a flying lead 31 is protruding, is disposed to face the rear surface 10SB of the image pickup element 10; and a second wiring board 40 wherein an upper surface 30SA of the first wiring board 30 is bonded to a second main surface 40SB, and a leading end surface 40SS is disposed to face the rear surface 10SB. The flying lead 31 is bent and connected to the second electrode 14, and a sealing member 51 sealing a connecting section between the second electrode 14 and the flying lead 31, and a bonding member 52 that bonds the rear surface 10SB and the leading end surface 40SS of the second wiring board 40 to each other are integrally configured using a curable resin 50.
Inventors:
SUYAMA TAKURO (JP)
Application Number:
PCT/JP2016/058144
Publication Date:
September 21, 2017
Filing Date:
March 15, 2016
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/04
Foreign References:
| JP2015008901A | 2015-01-19 | |||
| JP2014075764A | 2014-04-24 | |||
| JP5750642B1 | 2015-07-22 | |||
| JP2014210041A | 2014-11-13 | |||
| JP2013219468A | 2013-10-24 | |||
| JP2011249870A | 2011-12-08 |
Attorney, Agent or Firm:
ITOH Susumu (JP)
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