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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2018/042850
Kind Code:
This image pickup device is configured from a first structure 20 and a second structure 40. The first structure 20 is provided with: a first substrate 21; a plurality of temperature detection elements 15, which are formed on the first substrate 21, and which detect temperature on the basis of infrared light; a drive line 72; and a signal line 71. The second structure 40 is provided with a second substrate 41, and a drive circuit, which is provided on the second substrate 41, and which is covered with a coat layer 43. The first substrate 21 is bonded to the coat layer 43, a void 50 is provided between each of the temperature detection elements 15 and the coat layer 43, and the drive line 72 and the signal line 71 are electrically connected to the drive circuit.

HOSAKA Hajime (4-14-1 Asahi-cho, Atsugi-sh, Kanagawa 14, 〒2430014, JP)
NITTA Yoshikazu (4-14-1 Asahi-cho, Atsugi-sh, Kanagawa 14, 〒2430014, JP)
OKUMURA Kenichi (4-14-1 Asahi-cho, Atsugi-sh, Kanagawa 14, 〒2430014, JP)
SUKEGAWA Shunichi (4-14-1 Asahi-cho, Atsugi-sh, Kanagawa 14, 〒2430014, JP)
Application Number:
Publication Date:
March 08, 2018
Filing Date:
June 28, 2017
Export Citation:
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SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho Atsugi-sh, Kanagawa 14, 〒2430014, JP)
International Classes:
G01J5/48; G01J1/02; G01J1/44; H04N5/225; H04N5/33; H04N5/369
Attorney, Agent or Firm:
YAMAMOTO Takahisa et al. (Room 301, Akiba Building 3-2, Ohsaki 4-chome, Shinagawa-k, Tokyo 32, 〒1410032, JP)
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