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Title:
IMAGE PICKUP DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/130702
Kind Code:
A1
Abstract:
An image pickup device relating to one embodiment of the present disclosure is configured by laminating a first substrate, a second substrate, and a third substrate in this order. The first substrate having a sensor pixel that performs photoelectric conversion, and the second substrate having a readout circuit are electrically connected to each other by means of first through wiring that is provided in an interlayer insulating film. The second substrate and the third substrate having a logic circuit are electrically connected to each other by joining pad electrodes to each other or by means of second through wiring penetrating the semiconductor substrate.

Inventors:
NAKAZAWA KEIICHI (JP)
KITANO YOSHIAKI (JP)
YAMASHITA HIROFUMI (JP)
ISHIDA MINORU (JP)
Application Number:
JP2018/036417
Publication Date:
July 04, 2019
Filing Date:
September 28, 2018
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L25/065; H01L25/07; H01L25/18; H04N5/369
Foreign References:
JP2014022561A2014-02-03
US20070018075A12007-01-25
US20140138752A12014-05-22
JP2013232647A2013-11-14
JP2013090127A2013-05-13
JP2007228460A2007-09-06
JP2014236183A2014-12-15
JP2010010402A2010-01-14
JP2009123865A2009-06-04
JP2004186407A2004-07-02
JP2013008989A2013-01-10
JP2009246246A2009-10-22
JP2003017558A2003-01-17
JP2012015400A2012-01-19
JP2014123771A2014-07-03
JP2011044489A2011-03-03
JP2011517506A2011-06-09
JP2006191081A2006-07-20
JP2015046638A2015-03-12
JP2001339057A2001-12-07
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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