Title:
IMAGE PICKUP DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/130702
Kind Code:
A1
Abstract:
An image pickup device relating to one embodiment of the present disclosure is configured by laminating a first substrate, a second substrate, and a third substrate in this order. The first substrate having a sensor pixel that performs photoelectric conversion, and the second substrate having a readout circuit are electrically connected to each other by means of first through wiring that is provided in an interlayer insulating film. The second substrate and the third substrate having a logic circuit are electrically connected to each other by joining pad electrodes to each other or by means of second through wiring penetrating the semiconductor substrate.
Inventors:
NAKAZAWA KEIICHI (JP)
KITANO YOSHIAKI (JP)
YAMASHITA HIROFUMI (JP)
ISHIDA MINORU (JP)
KITANO YOSHIAKI (JP)
YAMASHITA HIROFUMI (JP)
ISHIDA MINORU (JP)
Application Number:
PCT/JP2018/036417
Publication Date:
July 04, 2019
Filing Date:
September 28, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L25/065; H01L25/07; H01L25/18; H04N5/369
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Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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