Title:
IMAGE PICKUP ELEMENT, ENDOSCOPE, AND ENDOSCOPE SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/187738
Kind Code:
A1
Abstract:
Provided are an image pickup element enabling to achieve further size reduction, an endoscope, and an endoscope system. An image pickup element 20 is provided with: a first chip 21; a second chip 22; and a fourth chip 24, which is connected by being laminated in the direction orthogonal to the surfaces on which the first chip 21 and the second chip 22 are laminated to each other, and which has a capacitor that functions as a bypass capacitor 241 for a power supply. The first chip 21, the second chip 22, and the fourth chip 24 respectively have connecting sections that electrically connect the chips to each other, and the connecting sections are disposed such that the connecting sections overlap each other when viewed from the direction orthogonal to the light receiving surface of a pixel section 211.
Inventors:
TANAKA TAKANORI (JP)
SAITO MASASHI (JP)
IGARASHI TAKATOSHI (JP)
ADACHI SATORU (JP)
HOSOGAI KATSUMI (JP)
AKAHANE NANA (JP)
SAITO MASASHI (JP)
IGARASHI TAKATOSHI (JP)
ADACHI SATORU (JP)
HOSOGAI KATSUMI (JP)
AKAHANE NANA (JP)
Application Number:
PCT/JP2017/006604
Publication Date:
November 02, 2017
Filing Date:
February 22, 2017
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
H01L27/14; A61B1/04; G02B23/24; H04N5/369
Domestic Patent References:
| WO2016006302A1 | 2016-01-14 | |||
| WO2013176055A1 | 2013-11-28 | |||
| WO2015050000A1 | 2015-04-09 |
Foreign References:
| JPH0946566A | 1997-02-14 | |||
| JP2015065479A | 2015-04-09 | |||
| JP2011050496A | 2011-03-17 | |||
| JP2008270650A | 2008-11-06 | |||
| JP2015115420A | 2015-06-22 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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